Semiconductor Heat Dissipation Layer for Dense Backside Power Dies
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Solution Overview
Problem
As semiconductor devices continue to shrink in feature size, they face challenges in heat dissipation and integration density, leading to performance and reliability issues due to increased thermal resistance and power delivery inefficiencies.
Innovation Solution
The implementation of high thermal conductivity materials, such as diamond-like-carbon (DLC), on a support substrate attached to the front-side interconnect structure of integrated circuit dies, which improves heat spreading and reduces thermal resistance by up to 1.33°C/W, enhancing chip performance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If minimum feature size is reduced to improve integration density, then more components can be integrated into a given area, but thermal resistance increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces a heat dissipation layer as an intermediary component between the semiconductor die and the ambient environment. This layer, made of high thermal conductivity material, acts as a thermal mediator that facilitates heat transfer from the densely integrated circuit components to the external environment, thereby resolving the thermal resistance issue caused by high integration density.
Solution Approach 2:
The patent employs composite material structures, specifically using heat dissipation layers composed of high thermal conductivity materials (such as diamond-like carbon or other thermally conductive substances) integrated with the semiconductor device. This composite approach combines the electrical functionality of the semiconductor components with the thermal management capabilities of the high-kappa material layer.
2Temperature
If high thermal conductivity materials are embedded to improve heat dissipation, then thermal resistance is reduced, but device complexity increases
Solution Approach 1:
The heat dissipation layer serves multiple functions simultaneously: it provides thermal management by conducting heat away from the semiconductor components, and it can also serve as part of the interconnect structure or packaging layer. This multi-functionality reduces the need for separate dedicated heat sinking components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively addresses heat dissipation and power delivery inefficiencies by embedding high-kappa materials, improving thermal management and overall performance of integrated circuit dies with backside power structures.
Implementation Method 1
one or more heat dissipation layers formed on the support substrate. The heat dissipation layers may be made of a high thermal conductivity material
Data Source
AI summary
A device includes a device layer comprising a first transistor; a first interconnect structure on a front-side of the device layer, and a second interconnect structure on a backside of the device layer. The second interconnect structure includes a power rail. The device further includes a carrier substrate bonded to the first interconnect structure and a first heat dissipation layer contacting the carrier substrate.