Semiconductor Package Heat Path Using Phase-Change Metal Particles
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Solution Overview
Problem
Highly integrated semiconductor devices in mobile terminals face challenges in heat dissipation due to space limitations, requiring efficient heat dissipation solutions that do not compromise on integration.
Innovation Solution
A semiconductor package incorporating a resin insulating body with phase change metal particles that connect the semiconductor chip to a heat dissipation member, facilitating effective heat transmission through a phase change process, thereby enhancing thermal conductivity and reducing supercooling phenomena.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If highly integrated semiconductor devices are implemented to increase functionality, then device capability is improved, but heat dissipation capability deteriorates due to space limitations
Solution Approach 1:
The patent utilizes phase change material particles that transition between solid and liquid states to absorb and transmit heat. The phase change process enables the heat transmission member to effectively manage heat generated by highly integrated semiconductor devices, resolving the contradiction between increased device capability and heat dissipation capability.
Solution Approach 2:
The heat transmission member is constructed as a composite material consisting of phase change material particles embedded in a resin matrix. This composite structure combines the heat absorption capability of phase change materials with the structural integrity of resin, enabling effective heat dissipation in highly integrated semiconductor devices.
2Device complexity
If conventional heat transmission members are used, then structural simplicity is maintained, but heat transmission efficiency deteriorates due to supercooling phenomena
Solution Approach 1:
The phase change material particles undergo phase transitions from solid to liquid and back, which prevents supercooling phenomena. This phase change mechanism ensures reliable heat transmission without requiring complex structural modifications, maintaining structural simplicity while improving heat transmission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation efficiency, reducing temperature increase times and preventing supercooling, thus effectively managing heat in densely packed semiconductor devices.
Implementation Method 1
phase change metal particles connected to each other in the resin insulating body, wherein the phase change metal particles connect the semiconductor chip and the heat dissipation member, the phase change metal particles being configured to transmit heat generated by the semiconductor chip to the heat dissipation member
Data Source
AI summary
Provided is a semiconductor package including a circuit board, a semiconductor chip on the circuit board, a heat dissipation member adjacent to the semiconductor chip, and a heat transmission member between the semiconductor chip and the heat dissipation member, the heat transmission member including a resin insulating body and phase change metal particles connected to each other in the resin insulating body, wherein the phase change metal particles connect the semiconductor chip and the heat dissipation member, the phase change metal particles being configured to transmit heat generated by the semiconductor chip to the heat dissipation member.