Semiconductor Package Heat Path Through Resin Mold and Housing
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Solution Overview
Problem
Existing electronic devices with semiconductor elements sealed by resin molds face challenges in achieving sufficient heat dissipation to the housing, necessitating improved heat dissipation performance.
Innovation Solution
The electronic device incorporates a semiconductor device with a resin mold and a heat dissipating member, both having higher thermal conductivity than the resist portion of the wiring board, allowing for enhanced heat dissipation to the housing through these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin mold seals the semiconductor element, then the semiconductor element is protected and sealed, but the heat dissipation performance to the housing is insufficient
Solution Approach 1:
The patent uses a resin mold with added heat dissipation filler (such as metal particles or ceramic particles) to create a composite material that maintains the sealing and protective functions of the resin while significantly improving thermal conductivity. This allows the semiconductor element to be protected by the resin mold while heat can be effectively conducted from the semiconductor through the resin mold to the heat dissipation member and housing.
2Temperature
If the housing is in direct thermal contact with the semiconductor device, then heat dissipation to the housing is improved, but the electrical insulation between the semiconductor device and housing is compromised
Solution Approach 1:
The patent introduces a heat dissipation member as an intermediary component between the semiconductor device and the housing. This heat dissipation member has high thermal conductivity to facilitate heat transfer but also provides electrical insulation. The resin mold with heat dissipation filler also acts as an intermediary that conducts heat while maintaining electrical insulation, allowing the housing to be in thermal contact with the semiconductor device through these intermediate layers without compromising electrical insulation.
3Temperature
If a heat dissipating member is added between the semiconductor device and housing, then heat dissipation path is improved, but the device structure becomes more complex
Solution Approach 1:
The patent makes the resin mold serve multiple functions: it provides sealing and protection for the semiconductor element, acts as an electrical insulator, and simultaneously functions as a heat dissipation path through the addition of heat dissipation filler. The heat dissipation member also serves dual purposes of thermal conduction and electrical insulation. By making components multi-functional, the patent improves the heat dissipation path without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in higher thermal conductivity in the heat dissipation path from the semiconductor element to the housing, thereby improving the heat dissipation performance and increasing the heat dissipation amount to the housing.
Implementation Method 1
Each of the resin mold and the heat dissipating member has a thermal conductivity higher than that of the resist portion
Data Source
AI summary
An electronic device includes a semiconductor device, a wiring board, a heat dissipating member, and a housing. The semiconductor device includes a semiconductor element, a conductive member electrically connected to the semiconductor element, and a resin mold sealing the semiconductor element. The wiring board includes a wiring portion on which the semiconductor device is mounted, and a resist portion disposed around the wiring portion. The heat dissipating member is in thermal contact with at least one of surfaces of the semiconductor device. The housing is in thermal contact with the semiconductor device through the heat dissipating member. Each of the resin mold and the heat dissipating member has a thermal conductivity higher than that of the resist portion.