Semiconductor Package Heat Emission Post Bonding
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Solution Overview
Problem
The bond strength between heat emitting posts and bonding members in semiconductor packages is reduced due to oxidation and corrosion when in contact with cooling water, leading to decreased durability and heat emission efficiency.
Innovation Solution
A semiconductor package design with optimized bonding distances and angles between heat emitting posts and metal layers, using bonding members with a plating layer to enhance oxidation resistance, and forming the package with materials like Sn, Ag, Au, Cu, Ti, Ni, or ceramic materials, with a thickness of 10 μm to 5 mm and a melting point of 100°C to 250°C, to improve bond strength and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding members are used to bond heat emitting posts to substrates, then heat emission function is achieved, but oxidation and corrosion occur when contacting cooling water, reducing bond strength and durability
Solution Approach 1:
A plating layer is introduced as an intermediary between the bonding member and the cooling water environment. This plating layer acts as a protective barrier that prevents direct contact between the bonding member and corrosive cooling water, thereby eliminating oxidation and corrosion while maintaining the bonding function.
Solution Approach 2:
The bonding structure is transformed into a composite system consisting of multiple layers: the bonding member, the plating layer, and potentially other protective layers. This composite structure combines the bonding properties of the original material with the corrosion resistance of the plating layer, achieving both strong bonding and durability in water environments.
2Duration of action of moving object
If bonding members contact cooling water, then cooling function is enabled, but durability of bonding members deteriorates due to oxidation and corrosion
Solution Approach 1:
The plating layer serves as a protective intermediary that allows the bonding member to maintain contact with the cooling water environment for extended periods without suffering from oxidation and corrosion. This intermediary layer preserves the durability of the bonding member while enabling continuous cooling operation.
3Strength
If bonding strength is increased, then structural stability is improved, but complexity of bonding structure increases
Solution Approach 1:
The plating layer modifies the surface parameters of the bonding member, creating a multi-layer structure that enhances bond strength through improved surface properties and adhesion characteristics without requiring complex bonding geometries or additional bonding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases bond strength and durability of the bonding members, preventing oxidation and corrosion, thereby enhancing heat emission efficiency and structural stability when in contact with cooling water.
Implementation Method 1
the side surface of the bonding member is partially plated with one or more metal layers or entirely includes the plating layer... improve durability of bonding members contacting cooling water... preventing oxidation and corrosion
Implementation Method 2
posts are bonded to a substrate by using a bonding member containing Ag or Cu interposed therebetween by soldering, sintering, or brazing
Implementation Method 3
posts are bonded to a substrate by using a bonding member containing Ag or Cu interposed therebetween by soldering, sintering, or brazing
Implementation Method 4
posts are bonded to a substrate by using a bonding member containing Ag or Cu interposed therebetween by soldering, sintering, or brazing
Implementation Method 5
heat transmitted from semiconductor components to the posts is cooled... one or more heat emitting posts bonded to the heat emitting metal layers
Data Source
AI summary
The present invention relates to a semiconductor package having a heat emitting post bonded thereto and a method of manufacturing the same, and more particularly, to a semiconductor package having a heat emitting post bonded thereto and a method of manufacturing the same that may increase bond strength of the heat emitting post and improve durability of bonding members contacting cooling water.