Semiconductor Package Heat Redistribution via Thermal Pillars
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Solution Overview
Problem
Highly integrated semiconductor packages face thermal stress due to increased heat generation from high-speed and high-capacity operations, which existing semiconductor packages struggle to manage effectively.
Innovation Solution
The semiconductor package design incorporates a first and second redistribution layer with thermal pillars and a heat radiator, where the redistribution lines penetrate an adhesive film to thermally connect the semiconductor chips, allowing heat generated from the first semiconductor chip to be dissipated through the redistribution lines and radiator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-speed and high-capacity semiconductor packages are used, then processing speed and capacity are improved, but thermal stress and heat generation increase
Solution Approach 1:
The heat dissipation system is segmented into multiple functional components: redistribution layers for heat conduction, thermal pillars for vertical heat transfer, and heat radiators for final heat dissipation. This segmentation allows each component to be optimized independently for its specific function in the heat management chain.
Solution Approach 2:
Redistribution layers serve as intermediary structures that perform dual functions: electrical signal routing and heat conduction. These intermediary elements connect the semiconductor chip to the thermal management system, enabling simultaneous electrical and thermal functionality through the same structural pathway.
2Temperature
If more thermal management components are added, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The redistribution layers are designed to perform multiple functions simultaneously: electrical signal routing and heat conduction. This multi-functionality reduces the need for separate dedicated thermal management structures, thereby managing complexity while maintaining effective heat dissipation.
Solution Approach 2:
The thermal management components (redistribution layers, thermal pillars, heat radiators) are merged into a unified integrated structure that works together as a cohesive thermal conduction pathway. This merging eliminates the need for separate complex thermal management systems while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation within the semiconductor package, increasing its reliability by effectively managing thermal stress and ensuring efficient heat removal from high-performance semiconductor chips.
Implementation Method 1
The redistribution line penetrates the adhesive film and is thermally connected to the first semiconductor chip
Implementation Method 2
an externally exposed heat radiator is thermally connected to the thermal pillars
Data Source
AI summary
A semiconductor package is provided including a first semiconductor package including a first semiconductor chip. The first semiconductor chip includes a first surface and a second surface opposite to the first surface. A second semiconductor package is disposed on the first semiconductor package. The second semiconductor package includes a second redistribution layer including a redistribution line. A second semiconductor chip is disposed on the second redistribution layer. A thermal pillar is disposed on the second redistribution layer. A heat radiator is disposed on the second semiconductor package and connected to the thermal pillar. The redistribution line is connected to the first semiconductor chip.