Semiconductor Mounting Platform With Integrated Heat Sink Blocks
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Solution Overview
Problem
Existing semiconductor packages for high-power applications require large amounts of expensive metal for heat dissipation, are not easily adaptable to different circuits, and lack efficient heat dissipation solutions.
Innovation Solution
A semiconductor package with an integrally formed heat sink in the mounting platform, comprising discrete metal blocks within an insulating substrate, providing efficient heat dissipation and customizable geometry for various applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large metal substrate or flange is used for heat dissipation, then heat dissipation performance is improved, but cost and material usage increase significantly
Solution Approach 1:
The heat sink is segmented into multiple discrete metal blocks positioned at specific locations within the insulating substrate, rather than using a single large metal substrate. This segmentation allows heat dissipation to be concentrated where needed while reducing overall metal consumption.
Solution Approach 2:
The patent applies heat dissipation resources locally by placing metal blocks only in regions where heat generation occurs, rather than using a uniform large metal substrate across the entire package. This localized approach improves thermal management efficiency while reducing material usage.
2Temperature
If a custom semiconductor package design with large metal substrate is used, then heat dissipation is improved, but adaptability to different circuits decreases
Solution Approach 1:
The mounting platform with integrally formed heat sink serves multiple functions: it provides mechanical support for the semiconductor die, establishes electrical connections through bond pads and vias, and dissipates heat through the metal blocks. This multi-functional design allows the same structure to be adapted to different circuit configurations without requiring completely custom designs for each application.
Solution Approach 2:
The patent enables adaptability through configurable design parameters such as the number, position, and size of metal blocks, as well as the arrangement of bond pads and vias. These dynamic design elements allow the mounting platform to be customized for different power levels and circuit requirements while maintaining the same basic structure.
3Adaptability or versatility
If discrete metal blocks are used in the heat sink, then manufacturing flexibility and adaptability are improved, but structural complexity increases
Solution Approach 1:
The heat sink metal blocks are integrally formed with the insulating substrate through a unified manufacturing process, combining what could be separate components into a single integrated structure. This merging simplifies assembly and reduces the number of discrete parts while maintaining the flexibility of discrete block geometry.
Solution Approach 2:
The metal blocks are positioned and integrated into the insulating substrate during the substrate formation process itself, rather than adding them as a separate post-processing step. This preliminary action simplifies the overall manufacturing process and reduces structural complexity despite the discrete nature of the heat sink elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution offers effective heat dissipation and electrical redistribution, enabling cost-effective semiconductor packages with performance comparable to metal flange designs while being adaptable to diverse circuit requirements.
Implementation Method 1
the heat sink is thermally coupled to the semiconductor die
Implementation Method 2
the heat sink extends from the upper surface of the mounting platform to a lower surface of the mounting platform
Data Source
AI summary
A semiconductor package includes a mounting platform including an electrically insulating substrate and structured metallization layers, a semiconductor die mounted on an upper surface of the mounting platform, the semiconductor die including a first terminal and a second terminal, the first terminal disposed on a second surface of the semiconductor die that faces the mounting platform, the second terminal disposed on a first surface of the semiconductor die that faces away from the mounting platform, and a heat sink integrally formed in the mounting platform. The heat sink is directly underneath the semiconductor die and is thermally coupled to the semiconductor die. The heat sink extends from the upper surface of the mounting platform to a lower surface of the mounting platform. The heat sink includes one or more discrete metal blocks disposed within an opening formed in the electrically insulating substrate.