Semiconductor Heat Sink Layout for Devices of Uneven Heights
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Solution Overview
Problem
Conventional semiconductor apparatuses face challenges in implementing a heat dissipation design suitable for semiconductor devices of varying heights, as existing methods require processing of heat dissipation fins to match each device's height, making it difficult to efficiently cool devices with different heat generation properties.
Innovation Solution
A semiconductor apparatus and manufacturing method that utilize resin heat dissipation materials and heat dissipation fins, where the resin materials are thermally coupled to semiconductor devices of different heights, allowing for adjustable heat dissipation paths through adjustable buffer materials, enabling efficient heat dissipation without the need for extensive fin processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat dissipation fin is processed to match the height of each semiconductor device, then heat dissipation efficiency is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat dissipation fins, each configured to contact semiconductor devices of different heights. This allows each fin to be optimized for specific device heights without requiring complex processing of a single fin structure, thereby resolving the contradiction between heat dissipation efficiency and processing complexity.
Solution Approach 2:
Different heat dissipation fins are designed with different properties (height, shape, thermal conductivity) to match the local requirements of semiconductor devices with different heights and heat generation properties. This localized optimization enables efficient heat dissipation for each device type without requiring complex processing of a universal fin structure.
2Reliability
If heat dissipation fin is processed for each semiconductor device, then heat dissipation performance is improved, but manufacturing time and cost increase
Solution Approach 1:
The heat dissipation fins are designed with universal applicability to accommodate multiple types of semiconductor devices with different heights. By creating a family of standardized fin configurations rather than custom-processing fins for each device, the system achieves both good heat dissipation performance and manufacturing efficiency.
Solution Approach 2:
Heat dissipation fins are pre-configured with specific heights and properties before assembly with semiconductor devices. This preliminary preparation allows for standardized manufacturing processes and simplifies the final assembly, improving overall manufacturing efficiency while maintaining optimal heat dissipation performance.
3Adaptability or versatility
If semiconductor devices of different heights are mounted on the same substrate, then device integration is improved, but heat dissipation design becomes difficult
Solution Approach 1:
The heat dissipation fin parameters (height, thickness, shape, material properties) are varied to match the different heights and heat generation properties of semiconductor devices. This parameter optimization allows efficient heat dissipation for integrated devices of varying heights without requiring complex heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a tailored heat dissipation design for semiconductor devices of varying heights, enhancing cooling efficiency and simplifying manufacturing by reducing the complexity of processing heat dissipation fins, while maintaining high heat dissipation performance.
Implementation Method 1
a first resin heat dissipation material having one surface facing a surface of each of the semiconductor devices and a heat dissipation fin to be thermally coupled to the first resin heat dissipation material
Implementation Method 2
a heat dissipation fin to be thermally coupled to the first resin heat dissipation material on a surface of the first resin heat dissipation material opposite to the surface facing the semiconductor devices
Implementation Method 3
a heat dissipation fin to be thermally coupled to the first resin heat dissipation material
Data Source
AI summary
A semiconductor manufacturing apparatus according to the present disclosure is configured such that a first resin heat dissipation material directly or indirectly contacts a heat dissipation surface of a semiconductor device having a low heat dissipation property. The first resin heat dissipation material has an opening that exposes a heat dissipation fin above a heat dissipation surface of a semiconductor device other than the semiconductor device that directly or indirectly contacts the first resin heat dissipation material. The heat dissipation fin is configured to pass through the opening of the first resin heat dissipation material and directly or indirectly contact the heat dissipation surface of the semiconductor device other than the semiconductor device that directly or indirectly contacts the first resin heat dissipation material.