Power Semiconductor Heat Sink Joining Without Mounting-Side Burrs
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Solution Overview
Problem
The existing friction stir welding method for semiconductor devices results in burrs and contamination on the component mounting surface, leading to increased production costs and potential damage, such as faulty insulation and thermal resistance issues.
Innovation Solution
A semiconductor device design where metal joining is performed between a case and a heat sink, with the case storing a power semiconductor and heat sink, using a tool for friction-stir welding or energy irradiation from the outside to eliminate burrs and contamination, allowing for efficient cooling at a small size and low cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If friction stir welding is performed from the component mounting side to join the case and heat dissipation board, then metal joining is achieved, but burrs and contamination are scattered on the component mounting surface causing damage and increased production cost
Solution Approach 1:
The patent applies inversion by performing friction stir welding from the opposite side (heat dissipation board side) rather than from the component mounting side. This reverses the welding direction to prevent burrs and contamination from reaching the component mounting surface, while still achieving secure metal joining between the case and heat dissipation board through the same welding mechanism.
2Strength
If friction stir welding is performed from the component mounting side, then metal joining is achieved, but manual removal of burrs and contamination is required increasing production time and cost
Solution Approach 1:
By inverting the welding direction to perform friction stir welding from the heat dissipation board side, the patent eliminates the need for subsequent manual removal of burrs and contamination from the component mounting surface. This single-direction welding approach from the opposite side simultaneously achieves both secure joining and surface cleanliness, thereby improving production efficiency.
3Ease of manufacture
If the semiconductor device is designed for small size and low cost, then manufacturing cost is reduced, but cooling efficiency and thermal management become more challenging
Solution Approach 1:
The patent merges the case and heat dissipation board into a single integrated metal structure through friction stir welding. This combination creates an efficient thermal path from the power semiconductor through the heat dissipation board to the case, enabling effective cooling in a compact design. The unified metal structure provides both mechanical support and thermal management functions, achieving small size, low cost, and good cooling efficiency simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the influence of burrs and contamination on the component mounting surface, improves yield and productivity, and enables effective cooling of power semiconductors with reduced thermal resistance and machining time, while maintaining a low production cost.
Implementation Method 1
a tool for FSW is applied from an upper part, toward the joining interface between the case and the heat dissipation board, to join them
Implementation Method 2
a heat sink, having a first surface on which the power semiconductor is provided, and a second surface on which a heat dissipation portion is provided
Data Source
AI summary
[Subject] The aim is to eliminate the influence on a component mounting surface by burrs and contamination which are produced at the time of metal joining, and to obtain the semiconductor device which can achieve cooling of a power semiconductor at a small size and at a low cost.[Solution] A semiconductor device, includes: a power semiconductor, a heat sink, having a first surface on which the power semiconductor is provided, and a second surface on which a heat dissipation portion is provided, and a case, made of metal, in which the power semiconductor and the heat sink are stored, wherein, penetrating the case, metal joining between the case and the heat sink is performed.