Semiconductor Heat Sink Design for Reduced Device Thickness
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Solution Overview
Problem
Conventional semiconductor devices with heat sinks covering multiple chips result in increased thickness due to uniform heat sink height matching the highest chip level, limiting the potential for reducing the overall device thickness.
Innovation Solution
A semiconductor device design where a heat sink is only provided above the semiconductor chip with a lower top surface level, allowing for a reduced thickness configuration by optimizing heat sink placement and structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat sink is provided to cover all semiconductor chips with uniform height matching the highest chip level, then all chips are covered for heat dissipation, but the overall device thickness increases
Solution Approach 1:
The heat sink is designed with different thicknesses for different regions. Specifically, the heat sink has a first thickness above the first semiconductor chip and a second thickness above the second semiconductor chip, where the second thickness is smaller than the first thickness. This local differentiation allows the heat sink to adapt to chips of different heights without requiring uniform coverage height, thereby reducing overall device thickness while maintaining effective heat dissipation contact with each chip.
2Reliability
If a heat sink is provided above each semiconductor chip, then heat dissipation is optimized for each chip, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
Instead of providing separate heat sinks above each semiconductor chip, the invention merges the heat dissipation function into a single integrated heat sink structure that serves multiple chips. This unified heat sink has varying thickness regions to contact different chip heights, simplifying the overall structure and reducing manufacturing complexity compared to multiple separate heat sink components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a thinner semiconductor device structure while maintaining effective heat dissipation, suitable for compact electronic equipment installations, with improved manufacturing simplicity and reduced stress on external electrode terminals.
Implementation Method 1
a heat sink fixed onto the first semiconductor chip
Implementation Method 2
heat sink for efficiently releasing heat generated in the semiconductor chip to the outside
Data Source
AI summary
A semiconductor device 1 includes a substrate 10, a semiconductor chip 20 (first semiconductor chip), semiconductor chips 30 (second semiconductor chips) and a heat sink 40. Semiconductor chips 20 and 30 are mounted on the substrate 10. The level of the top surface of the semiconductor chip 20 on the substrate 10 is lower than the level of the top surface of the semiconductor chip 30. A heat sink 40 is fixed to the semiconductor chip 20. Among the semiconductor chip 20 and the semiconductor chips 30, only above the semiconductor chip 20 is provided with the heat sink 40.