Semiconductor Package Heat Slug Thermal Pressurization
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Solution Overview
Problem
The current assembling process for chip-on-chip semiconductor packages is complex and prone to failures, particularly during the formation of the mold structure, which can compromise the reliability and operating characteristics of the semiconductor package.
Innovation Solution
A method involving the stacking of semiconductor chips on a circuit substrate with insulating adhesive patterns, thermally pressurizing heat slugs to bond the chips, and forming a mold structure that covers the chips and heat slugs, ensuring a sufficient area and thickness of the heat slug before forming the mold to reduce manufacturing failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the current assembling process is used for forming COC semiconductor packages, then the chips can be stacked and connected, but the process becomes quite complicated and prone to failures
Solution Approach 1:
The patent applies preliminary action by pre-forming heat slugs on the semiconductor chips before the molding process. This preliminary preparation ensures that the heat dissipation structures are already in place and properly positioned, eliminating the need for complex post-assembly heat slug installation and reducing assembly failures.
Solution Approach 2:
The patent merges the heat slug formation process with the chip stacking and molding processes. By integrating these steps into a unified manufacturing flow where heat slugs are formed directly on the chips during assembly, the overall process complexity is reduced while maintaining reliability.
2Productivity
If the mold structure is formed without sufficient heat slug area and thickness, then the manufacturing process can proceed quickly, but failures occur during mold structure formation
Solution Approach 1:
The patent ensures that heat slugs are pre-formed with sufficient area and thickness before the molding process begins. This preliminary verification prevents manufacturing failures during mold structure formation while maintaining efficient production speeds.
Solution Approach 2:
The patent applies beforehand cushioning by designing heat slugs with excessive area and thickness beyond the minimum requirements. This provides a safety margin that prevents manufacturing failures during the molding process, cushioning against variations in the manufacturing process.
3Strength
If heat slugs are thermally pressurized at high temperature and pressure to bond chips, then the bonding strength increases, but the process requires more energy and time
Solution Approach 1:
The patent optimizes the thermal pressurization parameters by carefully selecting temperature and pressure ranges that achieve sufficient bonding strength without excessive energy consumption. The heat slugs are thermally pressurized at controlled parameters that balance bonding quality with energy efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the likelihood of package failures during the manufacturing process, resulting in semiconductor packages with improved reliability and operating characteristics.
Implementation Method 1
the heat slugs are thermally pressurized to bond the underlying semiconductor chips to each other
Implementation Method 2
first semiconductor chips may be bonded to the circuit substrate by a reflow process
Data Source
AI summary
In one embodiment, a semiconductor package includes a circuit substrate, a plurality of semiconductor chips stacked on the circuit substrate, insulating adhesive patterns interposed between the semiconductor chips, a heat slug provided on an uppermost semiconductor chip and adhered to the uppermost semiconductor chip by a heat dissipative adhesive pattern, and a mold structure provided on the circuit substrate to cover sidewalls of the semiconductor chips, the insulating adhesive patterns, the heat dissipative adhesive pattern and the heat slug. A failure of the semiconductor package during a manufacturing process of the mold structure may be reduced. The semiconductor package may therefore have good operating characteristics and reliability.