Semiconductor Heat Slug Segmentation for Thermal Management
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Solution Overview
Problem
The existing semiconductor device designs face challenges in achieving stable and efficient heat radiation, particularly due to the small size of the spacer over the second semiconductor chip, leading to low manufacturing yield and inadequate heat dissipation, as well as potential peeling issues between the heat slug and spacer or chip.
Innovation Solution
A semiconductor device structure featuring a wiring board with a SoC chip and a PHY chip mounted side by side, where spacers and heat slugs are strategically positioned to enhance heat transfer, with the spacer between the chip and the wiring board and the heat slug, and a sealing member covering the components to prevent shorting and improve thermal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a small spacer is used over the second semiconductor chip to accommodate the chip size, then the device structure can be compact, but the manufacturing yield decreases and heat radiation becomes inadequate
Solution Approach 1:
The patent divides the heat radiation system into two independent segments: one heat slug for the first semiconductor chip and another heat slug for the second semiconductor chip. This segmentation allows each heat slug to be independently sized and positioned, enabling the second heat slug to have sufficient dimensions for reliable heat radiation while maintaining overall device compactness through optimized spatial arrangement.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by positioning heat slugs at different locations and orientations relative to the semiconductor chips. The first heat slug is placed over the first chip while the second heat slug is positioned over the second chip, allowing each to have adequate surface area for heat radiation without increasing the planar footprint excessively.
2Volume of moving object
If a small spacer is used over the second semiconductor chip, then the device structure can be compact, but the heat radiation efficiency decreases
Solution Approach 1:
The heat radiation function is segmented into separate heat slugs for each semiconductor chip. The second heat slug is specifically designed with sufficient dimensions to provide adequate heat radiation area for the second semiconductor chip, while the first heat slug handles the first chip's heat dissipation, allowing compact overall design without compromising thermal performance.
Solution Approach 2:
The patent introduces a second heat slug as an intermediary thermal management component specifically for the second semiconductor chip. This heat slug acts as a mediator between the second chip and the ambient environment, providing efficient heat transfer path while maintaining compact device structure through optimized positioning and dimensions.
3Device complexity
If adhesive is used to mount the small spacer over the second semiconductor chip, then the assembly can be simple, but peeling occurs between the heat slug, spacer, and chip
Solution Approach 1:
The mounting structure is segmented into separate adhesive bonding interfaces for each heat slug-chip-spacer assembly. The second heat slug is mounted with sufficient adhesive area on both the spacer and the second semiconductor chip, creating stable bonding interfaces that prevent peeling while maintaining assembly simplicity.
Solution Approach 2:
The patent applies adhesive beforehand to the spacer and/or heat slug surfaces with adequate coverage area, creating a cushioning bonding layer that prevents peeling between the second heat slug, spacer, and second semiconductor chip. This prior cushioning ensures stable assembly before final positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure improves heat radiation characteristics by increasing the spacer size to enhance thermal transfer and prevent shorting, thereby maintaining operational temperatures at 125° C or less and increasing manufacturing yield.
Implementation Method 1
a first adhesive layer 19 bonding the first spacer 7 to the first semiconductor chip 1, a second adhesive layer 20 bonding the heat slug 9 to the first spacer 7
Implementation Method 2
a first spacer 7 located between the first semiconductor chip 1 and the heat slug 9
Data Source
AI summary
A semiconductor device with improved heat radiation characteristics. It includes: a wiring board having a chip mounting surface and a plurality of electrode pads formed over the chip mounting surface; a semiconductor chip located over the chip mounting surface of the wiring board, having a plurality of bonding pads; a plurality of wires for coupling the electrode pads and the bonding pads; a heat slug located over the semiconductor chip; and a sealing member covering the chip mounting surface of the wiring board, the semiconductor chip, the wires, and the heat slug. A spacer lies between the chip mounting surface of the wiring board and the semiconductor chip and the sealing member lies between the semiconductor chip and the heat slug.