Semiconductor Device Heat Source Recess for Temperature Sensing
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Solution Overview
Problem
In miniaturized semiconductor devices, the close arrangement of heat source and temperature sensing elements does not provide sufficient thermal protection due to increased heat generation density and reduced size, leading to inadequate temperature detection precision and efficiency.
Innovation Solution
A semiconductor device design featuring a U-shaped heat source element with a space portion for efficient arrangement of a temperature sensing element, where the distance between the central portion of the temperature sensing element and the coupling region is shorter than the distances to the opposing regions, enhancing heat conduction and temperature detection sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature sensing element is arranged near the heat source element to enhance temperature detection sensitivity, then temperature detection precision is improved, but in miniaturized semiconductor devices with increased heat generation density, the detection precision becomes insufficient
Solution Approach 1:
The heat source element is divided into multiple heat generating regions (first, second, and third regions) with different widths. The temperature sensing element is strategically positioned to detect temperatures from multiple segments, allowing comprehensive monitoring despite miniaturization and high heat density.
Solution Approach 2:
Different regions of the heat source element have different widths to create varied thermal characteristics. The first and second regions have larger widths for higher heat generation, while the third region has a smaller width. The temperature sensing element is positioned to detect temperatures from these locally differentiated regions, improving overall detection precision in miniaturized devices.
2Volume of moving object
If the semiconductor device is miniaturized to reduce size, then device compactness is improved, but temperature detection efficiency deteriorates due to reduced space for proper element arrangement
Solution Approach 1:
The patent utilizes the width dimension of the heat source element to create multiple heat generating regions with different thermal characteristics. By varying the width along one dimension, the invention achieves effective temperature monitoring in miniaturized devices without requiring increased device volume, thus maintaining compactness while improving detection efficiency.
Solution Approach 2:
The heat source element features asymmetric width distribution across different regions. The first and second regions have larger widths compared to the third region, creating intentional thermal asymmetry. This asymmetric design allows the temperature sensing element to effectively monitor temperature gradients in a compact configuration, improving detection efficiency without increasing device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves temperature detection precision and efficiency by optimizing the arrangement of the heat source and temperature sensing elements, ensuring effective thermal protection and monitoring in semiconductor devices.
Implementation Method 1
enhancing heat conduction and temperature detection sensitivity
Data Source
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AI summary
This semiconductor device (10) has a heat source element (HSE) and a thermosensor element (TE) on a semiconductor chip (SCH). The profile of the heat source element (HSE) in plan view is recessed, and the depth (y1) of the recessed space (SP) is set to a size from 0.75 to 0.25 times that of the total length (y0). The center part (Tc) of the thermosensor element (TE) is situated in proximity to one side of a linking area (hse3), and is positioned in the space (SP) in such a way that length (y3) is shorter than length (x31a) and length (x31b). In so doing, heat source element temperature detection sensitivity and efficient positioning of the semiconductor elements can be achieved.