Semiconductor Heat Spreader Interface for Uniform Chip Temperatures
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Solution Overview
Problem
Temperature variations between heat generating elements in semiconductor apparatuses can cause malfunctions, as existing technologies fail to effectively manage thermal dissipation across these elements.
Innovation Solution
A semiconductor apparatus design featuring a substrate with heat generating elements interposed between a heat dissipation member and a heat conduction member, where the heat conduction members have specific thermal expansion coefficients and thermal conductivity, allowing for efficient thermal interface materials (TIMs) to contact each other, thereby adjusting contact thermal resistance based on temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heat generating elements are mounted on a substrate, then functional integration is improved, but temperature variations between elements increase causing malfunctions
Solution Approach 1:
A heat dissipation member is introduced as an intermediary component between the heat generating elements and the substrate. This mediator captures and conducts heat away from the heat generating elements, preventing excessive temperature variations that would cause malfunctions while allowing the elements to remain integrated on the substrate.
Solution Approach 2:
The thermal conductivity parameter of the heat dissipation member is specifically optimized to achieve effective heat transfer. By changing the thermal conductivity parameter of the intermediate material, the system balances heat dissipation efficiency with maintaining appropriate temperature distributions across the heat generating elements.
2Temperature
If heat dissipation member is added between heat generating elements and substrate, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat dissipation member serves multiple functions simultaneously: it acts as a thermal management component, provides mechanical support, and serves as a mounting platform for the heat generating elements. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The heat dissipation member is integrated with the substrate structure, combining thermal management functionality with the base support structure. This merging approach avoids adding completely separate complex subsystems while achieving effective temperature control.
3Loss of energy
If thermal interface materials are used between heat conduction members, then heat transfer efficiency is improved, but contact thermal resistance increases
Solution Approach 1:
The thermal conductivity parameter of the thermal interface materials is optimized to minimize contact thermal resistance. By carefully selecting and tuning the thermal conductivity parameter of the TIMs, the system achieves efficient heat transfer across interfaces while keeping thermal resistance losses minimal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces temperature variations among heat generating elements by optimizing heat transfer and dissipation, ensuring efficient thermal management and minimizing thermal resistance.
Implementation Method 1
at least one first heat conduction member provided on a first surface of the heat dissipation member, the first surface facing the heat generating elements, and a plurality of second heat conduction members each provided on a second surface of a corresponding one of the heat generating elements
Implementation Method 2
a heat dissipation member fixed to the substrate and disposed such that the heat generating elements are interposed between the heat dissipation member and the substrate
Implementation Method 3
the heat conduction members have specific thermal expansion coefficients and thermal conductivity, allowing for efficient thermal interface materials (TIMs) to contact each other, thereby adjusting contact thermal resistance based on temperature changes
Data Source
AI summary
A semiconductor apparatus includes a substrate, a plurality of heat generating elements mounted on the substrate, a heat dissipation member fixed to the substrate and disposed such that the heat generating elements are interposed between the heat dissipation member and the substrate, at least one first heat conduction member provided on a first surface of the heat dissipation member, the first surface facing the heat generating elements, and a plurality of second heat conduction members each provided on a second surface of a corresponding one of the heat generating elements, the second surface facing the heat dissipation member, wherein the at least one first heat conduction member and the second heat conduction members are in contact with each other at an interface between opposing surfaces thereof.