Semiconductor Package Heat Spreader Layout for Dense Chip Cooling
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Solution Overview
Problem
As the minimum feature sizes in semiconductor devices are reduced, additional challenges arise in terms of heat dissipation, device performance, and defect reduction.
Innovation Solution
The implementation of packaged semiconductor devices with heat-dissipating structures, including thermally conductive dummy features, front-side and backside heat spreaders, conductive cap heat spreaders, and lateral heat spreaders, to improve heat dissipation and device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If minimum feature sizes are reduced to improve integration density, then more components can be integrated into a given area, but heat dissipation becomes more difficult and device performance deteriorates
Solution Approach 1:
The patent introduces heat-dissipating structures that extend in multiple dimensions beyond the traditional planar heat sink approach. Heat spreaders are positioned both above and below the semiconductor device, creating a three-dimensional heat dissipation architecture. This multi-dimensional approach increases the effective heat dissipation surface area without increasing the device footprint, thereby maintaining high integration density while improving heat dissipation capability.
Solution Approach 2:
The heat dissipation system is divided into multiple separate components: front-side heat spreaders, backside heat spreaders, lateral heat spreaders, and heat sinks. Each component performs a specific function in the heat dissipation pathway. The heat spreaders are further segmented into multiple layers and positions, allowing heat to be distributed and dissipated through multiple pathways simultaneously, improving overall heat dissipation efficiency while maintaining compact form factor.
2Productivity
If minimum feature sizes are reduced to improve integration density, then more components can be integrated into a given area, but device performance and reliability deteriorate due to heat accumulation
Solution Approach 1:
By implementing heat spreaders in multiple dimensions (front-side, backside, and lateral positions), the patent creates efficient heat dissipation pathways that prevent heat accumulation in the densely integrated device. This multi-dimensional heat management approach maintains device performance and reliability by ensuring adequate thermal evacuation from all critical regions of the high-density device layout.
Solution Approach 2:
The heat-dissipating structures are strategically positioned at specific locations where heat generation is most critical. Front-side heat spreaders are placed over hot spots on the device front, backside heat spreaders are positioned corresponding to heat-generating regions on the device back, and lateral heat spreaders address side-ward heat flow. This localized heat management approach ensures that each region of the high-density device receives appropriate thermal management, maintaining overall device reliability.
3Device complexity
If traditional heat dissipation structures are used, then device structure is simple, but transient thermal performance is insufficient for high-density integration
Solution Approach 1:
The heat dissipation system is segmented into multiple functional components: front-side heat spreaders, backside heat spreaders, lateral heat spreaders, and heat sinks. Each segment addresses specific thermal management needs. The front-side and backside heat spreaders are further divided into multiple layers positioned at different heights, creating a segmented thermal management architecture that improves transient thermal performance while maintaining reasonable structural complexity through modular design.
Solution Approach 2:
The heat-dissipating structures are nested in a hierarchical arrangement where heat spreaders are positioned at multiple levels above and below the semiconductor device, with heat sinks providing the outermost thermal evacuation interface. The heat spreaders are nested between the device and the heat sinks, creating a layered thermal management structure. This nesting approach maximizes heat dissipation efficiency within a compact volume while organizing the structure in a systematic, manageable manner.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The incorporation of heat-dissipating structures enhances transient thermal performance, improves device performance, and reduces device defects by effectively managing heat generated in semiconductor devices.
Implementation Method 1
heat-dissipating structures, including thermally conductive dummy features, front-side and backside heat spreaders
Implementation Method 2
conductive cap heat spreaders, and lateral heat spreaders, to improve heat dissipation and device performance
Data Source
AI summary
Packaged semiconductor devices including heat-dissipating structures and methods of forming the same are disclosed. In an embodiment, a semiconductor package includes a semiconductor die including a substrate, a front-side interconnect structure on a front-side of the substrate, and a backside interconnect structure on a backside of the substrate opposite the front-side interconnect structure; a support die disposed on the front-side interconnect structure; a heat-dissipating structure on the support die, the heat-dissipating structure being thermally coupled to the semiconductor die and the support die; a redistribution structure on the backside interconnect structure opposite the substrate, the redistribution structure being electrically coupled to the semiconductor die; and an encapsulant on the redistribution structure and adjacent to side surfaces of the semiconductor die, the support die, and the heat-dissipating structure.