Semiconductor Package Heat Spreader for Thermal and EMI Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multi-chip semiconductor packages face challenges with heat management and electromagnetic interference (EMI) due to high temperatures and increased packing density, leading to potential malfunctions and reduced electrical performance.
Innovation Solution
A semiconductor package design incorporating a heat spreader with high thermal conductivity, positioned between top packages to distribute heat and separate them, while also acting as a shield to prevent EMI, utilizing a metallic material with a partition wall shape and extension segments to effectively dissipate heat and absorb electromagnetic waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are mounted on a printed circuit board to increase packing density, then productivity and functionality are improved, but heat generation increases and electromagnetic interference occurs causing malfunctions
Solution Approach 1:
A heat spreader is introduced as an intermediary component between the semiconductor chips and the printed circuit board. This heat spreader serves as a mediator to conduct heat away from the chips, preventing overheating and electromagnetic interference while maintaining high packing density. The heat spreader is attached to the bottom of the package and extends laterally to provide thermal management for multiple chips.
Solution Approach 2:
The heat spreader is divided into multiple heat spreading regions, with each region corresponding to a specific semiconductor chip. This segmentation allows each chip to have its own dedicated heat dissipation path, preventing heat accumulation and electromagnetic interference between adjacent chips while maintaining high packing density.
2Power
If heat is generated by semiconductor chips during operation, then power consumption and functionality are improved, but temperature increases causing overload and malfunctions
Solution Approach 1:
The heat spreader acts as a thermal intermediary between the semiconductor chips and the printed circuit board. It conducts heat away from the chips through its high thermal conductivity material, maintaining operational temperatures while allowing the chips to consume sufficient power for their functions.
Solution Approach 2:
The heat spreader is designed with different heat spreading regions, each with specific thermal properties tailored to the corresponding chip's power consumption and heat generation characteristics. This allows optimized heat management for each chip while maintaining overall package performance.
3Volume of moving object
If semiconductor chips are placed close together to reduce package size, then volume is reduced, but electromagnetic interference between chips increases causing malfunctions
Solution Approach 1:
The heat spreader serves as an electromagnetic shield in addition to its thermal management function. By positioning the heat spreader between the chips and the printed circuit board, it blocks electromagnetic interference paths while maintaining compact package dimensions.
Solution Approach 2:
The heat spreader is segmented into separate heat spreading regions, each acting as an independent electromagnetic shield for its corresponding chip. This segmentation prevents electromagnetic interference between adjacent chips while maintaining small package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal stability by minimizing heat transfer to upper semiconductor chips, preventing damage and improving electrical characteristics by reducing EMI between packages, resulting in efficient heat dissipation and reliable operation.
Implementation Method 1
A variety of semiconductor chips, such as central processing units and power integrated circuits, are mounted on multi-layered printed circuit boards. Such semiconductor chips generate high temperatures when they are operated.
Implementation Method 2
When many semiconductor chips are mounted on a printed circuit board, electromagnetic interference (EMI) may be generated between the semiconductor chips.
Data Source
AI summary
A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interposed between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.