Semiconductor Package Heat-Spreading Metal Layer Layout
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Solution Overview
Problem
Conventional semiconductor devices face challenges in efficiently radiating heat generated from electronic components due to insufficient heat dispersion in the surface direction of the metal plate, leading to reduced heat radiation efficiency, particularly for components that generate a large amount of heat.
Innovation Solution
The semiconductor device incorporates a metal layer made of the same material as the wiring layer, covering the surface of the metal plate opposite to the sealing resin, which enhances heat dispersion in the surface direction, complementing the heat conduction in the thickness direction, thereby improving overall heat radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal plate is bonded to the electronic component to increase heat radiation path, then the heat conduction path is extended, but the heat dispersion in surface direction is insufficient due to the thin thickness of the metal plate
Solution Approach 1:
The invention extends the heat radiation structure from a single thin metal plate to a multi-layered configuration with metal plates on both surfaces of the insulating base material. This adds a spatial dimension to heat dissipation, allowing heat to radiate through multiple paths simultaneously (through the insulating base material in thickness direction and through surface metal plates in surface direction), thereby resolving the contradiction between extended heat conduction path and sufficient surface heat dispersion area
Solution Approach 2:
The invention combines multiple heat radiation paths by integrating metal plates on both surfaces with the insulating base material structure. The metal plates on the first and second surfaces work together with the via holes and wiring layers to create a comprehensive heat radiation network, merging conduction and radiation functions to achieve both extended heat conduction path and sufficient surface heat dispersion
2Temperature
If the metal plate thickness is increased to improve surface heat dispersion, then the heat radiation efficiency improves, but the device structure becomes more complex and larger
Solution Approach 1:
Instead of increasing metal plate thickness in one dimension, the invention distributes heat radiation functions across multiple dimensions by placing metal plates on both surfaces of the insulating base material. This multi-dimensional approach achieves sufficient heat dispersion without requiring excessive thickness in any single plate, thereby maintaining structural compactness while improving heat radiation efficiency
Solution Approach 2:
The heat radiation function is segmented into multiple independent components: metal plates on the first surface, metal plates on the second surface, via holes, and wiring layers. Each segment contributes to heat radiation independently, allowing the system to achieve high heat radiation efficiency through distributed functionality rather than relying on a single thick metal plate, thus reducing overall structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases the heat radiation efficiency by facilitating both thickness and surface direction heat dispersion, ensuring efficient heat dissipation from the electronic component.
Implementation Method 1
the heat generated from the electronic component is conducted in a thickness direction of the metal plate, and is then radiated to the outside
Implementation Method 2
a metal layer that is made of a same metal material as that used for the wiring layer and the via, and that covers a surface of the metal plate located on a side opposite to a surface that is covered by the sealing resin
Implementation Method 3
the wiring layer is connected to the electronic component by way of a via that passes through the insulating base material and the adhesive layer
Data Source
AI summary
A semiconductor device includes an insulating base material that includes an adhesive layer on one of surfaces of the insulating base material; an electronic component that is fixed to the one of the surfaces; a metal plate that is arranged to sandwich the electronic component with the one of the surfaces; a sealing resin that is filled between the insulating base material and the metal plate; a wiring layer that is formed on another of the surfaces, and connected to the electronic component by way of a via; and a metal layer that is made of a same metal material as that used for the wiring layer and the via, and covers a surface of the metal plate located on a side opposite to a surface that is covered by the sealing resin.