Semiconductor Package Heat Spreading With Dual-Sided Metal Layers
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Solution Overview
Problem
Conventional semiconductor devices face challenges in efficiently radiating heat generated by electronic components due to insufficient heat dispersion in the surface direction of thin metal plates, leading to reduced heat radiation efficiency, especially for components that generate a large amount of heat.
Innovation Solution
A semiconductor device design that includes a metal plate sandwiching an electronic component with an insulating base material, a sealing resin covering the assembly, and a wiring layer connected via a via through the base material, with a metal layer covering the opposite surface of the metal plate, using the same metal material as the wiring layer to enhance heat dispersion in both thickness and surface directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thin metal plate is used to bond the electronic component, then the device structure is compact and easy to manufacture, but heat radiation efficiency is insufficient because heat dispersion in the surface direction is inadequate
Solution Approach 1:
The patent adds a metal layer on the opposite surface of the metal plate to create a two-sided heat dissipation structure. This transforms the single-sided heat conduction path into a multi-dimensional heat radiation system, enabling heat to disperse in both thickness and surface directions simultaneously, thereby resolving the contradiction between compact structure and heat radiation efficiency.
Solution Approach 2:
The patent combines the metal plate with an additional metal layer made of the same metal material as the wiring layer and via. This composite structure enhances heat dispersion capability in the surface direction while maintaining the compactness of the original thin metal plate structure, thus improving heat radiation efficiency without sacrificing ease of manufacture.
2Device complexity
If heat is conducted only in the thickness direction of the metal plate, then the structure is simple, but heat dispersion in the surface direction is insufficient leading to poor heat radiation efficiency
Solution Approach 1:
The patent introduces heat conduction in the surface direction by adding a metal layer on the opposite surface of the metal plate. This creates additional heat conduction paths in multiple directions (both thickness and surface directions), transforming the simple single-direction heat conduction structure into a multi-directional heat radiation system, thereby improving heat radiation efficiency while maintaining relatively simple structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat radiation efficiency by facilitating heat conduction and dispersion in both the thickness and surface directions of the metal plate, effectively managing heat generated by electronic components.
Implementation Method 1
the heat generated from the electronic component is conducted in a thickness direction of the metal plate, and is then radiated to the outside
Implementation Method 2
dispersion of heat in a surface direction of the metal plate (in the direction perpendicular to the thickness direction) is not sufficiently performed
Data Source
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AI summary
A semiconductor device (100) includes an insulating base material (110) that includes an adhesive layer (111) on one (110b) of surfaces of the insulating base material (110); an electronic component (120) that is fixed to the one (110b) of the surfaces; a metal plate (130) that is arranged to sandwich the electronic component (120) with the one (110b) of the surfaces; a sealing resin (140) that is filled between the insulating base material (110) and the metal plate (130); a wiring layer (150) that is formed on another (110a) of the surfaces, and connected to the electronic component (120) by way of a via (151); and a metal layer (160) that is made of a same metal material as that used for the wiring layer (150) and the via (151), and covers a surface (130b) of the metal plate (130) located on a side opposite to a surface (130a) that is covered by the sealing resin (140).