Aerosol Provision Device Semiconductor Heater Support for Breakage Resistance
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Solution Overview
Problem
Semiconductor heating elements in aerosol provision devices are prone to breaking due to regular use, necessitating a solution to enhance durability and prevent damage.
Innovation Solution
Attaching a semiconductor heating element to a support element, which can be made from materials like silicon carbide or gallium nitride, using deposition techniques to form a robust heating arrangement that includes a planar or tubular configuration, providing structural support and thermal insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a semiconductor heating element is used in an aerosol provision device, then efficient heat transfer and energy consumption are achieved, but the heating element is prone to breaking due to regular use
Solution Approach 1:
A support element made of ceramic or glass material is introduced as an intermediary between the semiconductor heating element and the external environment. This support element provides mechanical strength and structural stability while allowing the fragile semiconductor element to maintain its efficient heating function without direct exposure to mechanical stress from regular use
2Use of energy by moving object
If the heating element is made thinner to improve heat transfer efficiency, then energy efficiency increases, but the element becomes more fragile and prone to breakage
Solution Approach 1:
The heating element is constructed as a composite structure combining a thin semiconductor heating element (10-500 micrometres thick) with a thicker support element (at least 80 micrometres thick). This composite design allows the thin semiconductor layer to provide efficient heat transfer while the thicker support layer provides the necessary mechanical strength and fracture resistance
3Reliability
If a thicker support element is used to protect the heating element, then durability improves, but the overall device size increases
Solution Approach 1:
The support element is designed as a thin-walled tubular structure with thickness of at least 80 micrometres, providing adequate mechanical protection and structural stability while maintaining a compact overall device size. The tubular configuration offers high strength-to-weight ratio and efficient heat distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heating element's durability is enhanced, reducing the likelihood of breakage and ensuring efficient heat transfer to aerosol-generating materials, thereby maintaining device functionality and longevity.
Implementation Method 1
a heating arrangement, configured to heat an article received within the article receiving portion, the heating arrangement comprising: at least one heating element comprising a semiconductor material
Implementation Method 2
a support element to which the at least one heating element is attached... the support element is formed from an electrically insulative and/or thermally insulative material
Implementation Method 3
the at least one heating element is deposited on the support element by at least one of physical vapor deposition or chemical vapor deposition
Implementation Method 4
the at least one heating element is deposited on the support element by at least one of physical vapor deposition or chemical vapor deposition
Data Source
Figure 1
Figure 2a~2b
Figure 3
AI summary
An aerosol provision device (100) comprises an article receiving portion (110) for receiving, in use, an article (120) comprising an aerosol generating material. The aerosol provision device (100) also comprises a heating arrangement (125) which is configured to heat an article (120) received within the article receiving portion (110). The heating arrangement (125) comprises at least one heating element (130) and a support element (140) to which the at least one heating element (130) is attached. The at least one heating element (130) comprises a semiconductor material.