Planar Semiconductor Heating Body With Microchannels for Dry Puff Control
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Solution Overview
Problem
Existing heating bodies for electronic cigarette products face issues such as 'dry puff', saturated boiling, harmful metal component release, and inadequate temperature control, leading to uneven heating and potential damage or contamination.
Innovation Solution
A method for manufacturing a planar heating body using metal-free semiconductor materials with integrated channels, employing a negative temperature coefficient (NTC) material to ensure uniform and controlled heating, and utilizing microchannels for precise temperature management and liquid flow control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If metal components are used in the heating body, then electrical conductivity and heating efficiency are improved, but harmful metal release and catalytic effects occur
Solution Approach 1:
The patent removes metal components from the heating body structure, extracting the harmful element while maintaining the heating function through alternative materials (semiconductor or ceramic) that do not release harmful substances
Solution Approach 2:
The patent introduces a coating layer as an intermediary between the heating element and the liquid, preventing direct contact between metal and liquid to eliminate harmful metal release and catalytic effects while allowing heat transfer to continue
2Productivity
If heating temperature is increased to improve evaporation efficiency, then evaporation rate is improved, but saturated boiling and local overheating occur
Solution Approach 1:
The patent divides the heating body into multiple heating zones or elements, distributing the heating function across several segments to prevent local overheating and saturated boiling while maintaining overall evaporation efficiency
Solution Approach 2:
The patent applies different properties to different regions of the heating body, such as varying the thickness, material composition, or surface characteristics in specific areas to control heat distribution and prevent localized overheating
3Productivity
If heating body operates at high temperature to ensure evaporation, then evaporation function is improved, but dry puff damage and component degradation occur
Solution Approach 1:
The patent applies protective coatings or surface treatments to the heating body before operation, creating a protective barrier that prevents damage from dry puff conditions and extends the lifespan of the heating element
Solution Approach 2:
The patent incorporates temperature sensing and control mechanisms that provide feedback to the heating system, allowing real-time adjustment of heating parameters to prevent overheating and damage while maintaining effective evaporation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents harmful metal releases, achieves homogeneous temperature distribution, and ensures reliable, precise, and safe evaporation of liquids in electronic cigarette products, reducing the risk of overheating and contamination.
Implementation Method 1
the heating body can consist of or be made from a material which, at least in an operating range, for example between 100° C. and 240° C., has a negative temperature coefficient (NTC), i.e. the electrical resistance of the heating body decreases as the temperature increases
Implementation Method 2
electrically operable heating body for an inhaler, in particular for an electronic cigarette product, preferably for evaporating liquid
Data Source
AI summary
Method for manufacturing an electrically operable heating body for an inhaler, wherein a semiconductor material is provided so as to be substantially planar, and a plurality of channels are incorporated into the semiconductor material substantially in the direction of the surface normal of the planar semiconductor material, such that a fluid can pass through the semiconductor material in the channels.