Semiconductor Heating Element with Connector Heating for Faster First Puffs
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Solution Overview
Problem
Existing smoking alternatives, such as heat-not-burn products, struggle with inefficient heating mechanisms that prolong the time to the first puff of aerosol production.
Innovation Solution
The use of a semiconductor heating element with strategically positioned electrical connectors and controlled current flow to create a Schottky barrier effect, resulting in differential heating rates across the element, particularly at the connector regions, to accelerate aerosol generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If conventional heating mechanisms are used in heat-not-burn products, then the device structure is simple, but the time to first puff is prolonged due to inefficient heating
Solution Approach 1:
The heating element is designed with non-uniform heating characteristics where regions adjacent to electrical connectors experience higher heating rates due to Schottky barrier effects, while the central region heats more slowly. This local quality variation enables faster aerosol generation at the connector regions without requiring complex control systems.
Solution Approach 2:
The heating element utilizes its own structural features (the electrical connectors and Schottky barriers) to automatically create differential heating patterns. The system self-regulates the heating process through the inherent electrical and thermal properties of the semiconductor material and connector interfaces, eliminating the need for external control mechanisms.
2Temperature
If uniform heating is applied across the heating element, then the temperature distribution is even, but the time to reach operating temperature is extended
Solution Approach 1:
The heating element performs preliminary heating action at the connector regions where Schottky barriers concentrate heat generation. This preliminary heating of specific zones accelerates the overall warming process, as these regions reach operating temperature faster and then transfer heat to the central region, reducing the total time to reach full operating temperature.
Solution Approach 2:
The system changes the heating rate parameter across different spatial locations by exploiting the Schottky barrier effect at electrical connector interfaces. This creates a gradient in heating rates (higher at connectors, lower in center) that optimizes the time to reach operating temperature while maintaining eventual thermal equilibrium.
3Productivity
If semiconductor material with Schottky barrier is used, then the heating rate at connector regions increases, but the device complexity increases
Solution Approach 1:
The heating element utilizes its own structural features (the electrical connectors and Schottky barriers) to automatically create differential heating patterns. The system self-regulates the heating process through the inherent electrical and thermal properties of the semiconductor material and connector interfaces, eliminating the need for external control mechanisms.
Solution Approach 2:
The system changes the heating rate parameter across different spatial locations by exploiting the Schottky barrier effect at electrical connector interfaces. This creates a gradient in heating rates (higher at connectors, lower in center) that optimizes the time to reach operating temperature while maintaining eventual thermal equilibrium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time to the first puff by generating additional heat at the connector regions, ensuring faster aerosol production and uniform temperature distribution across the heating element.
Implementation Method 1
the first electrical connector and/or the second electrical connector comprises a metal and forms a Schottky Barrier with the semiconductor material of the heating element
Implementation Method 2
heating element comprising a semiconductor material... rate of heating in the first region and/or a rate of heating in the second region is, for at least an initial time duration, greater than a rate of heating in the third region
Data Source
Figure 1
Figure 2~3D
Figure 4A~5
AI summary
An aerosol provision device, an aerosol provision system, and a method of controlling an aerosol provision device. The aerosol provision device comprises a heating element comprising a semiconductor material. The heating element is electrically connected to a power supply by first and second electrical connectors, so that when power is supplied to the heating element, a rate of heating in a first region adjacent the first electrical connector and/or a rate of heating in a second region adjacent the second electrical connector is, for at least an initial time duration, greater than a rate of heating in a third region between the first and second regions.