Semiconductor Heating Oven With Segmented Carrier Modules
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Solution Overview
Problem
Existing heating apparatuses for semiconductor devices do not allow for the initiation of a burn-in or reliability test for new carriers loaded with semiconductor devices without disrupting the temperature environment, requiring the apparatus to be opened and affecting the devices under test.
Innovation Solution
A heating apparatus design featuring a removable carrier module that allows new semiconductor devices to be loaded and tested at high temperatures within the same oven without opening the apparatus, utilizing a carrier module with a self-closing door system and a temperature-controlling module to maintain a stable temperature environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the heating apparatus is opened to load new carriers with semiconductor devices, then new devices can be loaded for testing, but the temperature environment is disrupted and existing devices under test are affected
Solution Approach 1:
The heating apparatus is divided into multiple independent heating chambers, each capable of maintaining its own temperature environment. Carriers with semiconductor devices are segmented into separate modules that can be independently loaded and tested. This allows new carriers to be introduced without disrupting the temperature stability of existing devices in other chambers.
2Productivity
If the heating apparatus operates continuously with multiple carriers, then testing efficiency is improved, but temperature control complexity increases
Solution Approach 1:
The temperature control system is segmented into multiple independent control units, each responsible for a specific heating chamber or carrier module. This modular approach allows continuous operation with multiple carriers while keeping each control unit relatively simple, as each unit only needs to manage its own chamber's temperature independently.
Solution Approach 2:
The heating apparatus is designed with universal carrier modules that can be used across multiple chambers. Each carrier module is designed to work with the standard heating and control system, allowing the same hardware to handle multiple different testing scenarios and device types, thereby increasing productivity without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous high-temperature testing of new semiconductor devices without affecting the temperature of devices already undergoing burn-in or reliability tests, ensuring efficient and uninterrupted testing processes.
Implementation Method 1
an oven (12) including a back wall (16) having a plurality of back openings (16A) and a front wall (14) having a plurality of front openings (14A)... a temperature-controlling module (50) configured to control the temperature of the oven (12)
Implementation Method 2
a carrier module (20) configured to load semiconductor devices into the oven (12) through the front opening (14A) in a removable manner
Data Source
AI summary
A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.