Semiconductor Device Height Adjuster Resin Shrinkage Stress
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Solution Overview
Problem
The shrinkage of thermosetting resin during the hardening process in semiconductor device packaging can cause stress and damage to semiconductor chips, particularly when there is a significant height difference between the semiconductor chip and other components, leading to potential warping of the package.
Innovation Solution
Incorporating a height adjuster, such as a dummy component, between the substrate and the semiconductor chip, which helps to distribute the stress caused by resin shrinkage, allowing for the use of thinner semiconductor chips and increasing design flexibility without increasing the substrate thickness or altering other conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting resin is used for sealing and retaining the semiconductor chip in the package, then the semiconductor chip is securely sealed and retained, but the resin shrinkage during hardening applies stress to the semiconductor chip causing potential damage
Solution Approach 1:
A resin cavity is introduced as an intermediary space between the semiconductor chip and the surrounding thermosetting resin. This cavity acts as a buffer zone that absorbs the shrinkage stress during resin hardening, preventing direct transmission of stress to the semiconductor chip while maintaining secure sealing and retention.
2Shape
If there is a significant height difference between the semiconductor chip and other components, then the semiconductor chip can be positioned at the required height, but the resin shrinkage stress increases causing potential warping of the package
Solution Approach 1:
The resin cavity serves as a compensatory intermediary space that absorbs dimensional discrepancies and shrinkage forces. By positioning the semiconductor chip within this cavity rather than directly in contact with the shrinking resin, the structure accommodates height differences while preventing stress-induced warping of the entire package.
Solution Approach 2:
The resin cavity is designed in advance as a cushioning space before resin hardening occurs. This pre-established void provides a buffer zone that anticipates and absorbs the shrinkage stress that will occur during curing, thereby preventing warping before it can affect the package structure.
3Length of moving object
If thinner semiconductor chips are used, then device miniaturization is achieved, but the chips become more susceptible to damage from resin shrinkage stress
Solution Approach 1:
The resin cavity acts as a protective intermediary that decouples the thin semiconductor chip from the stress-generating resin. This allows the use of thinner, more miniaturized chips while the cavity absorbs the shrinkage forces that would otherwise damage the fragile thin structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the risk of damage to the semiconductor chip and warping of the device by minimizing the stress from resin shrinkage, enabling the use of semiconductor chips that may not meet size specifications for other devices, while maintaining the structural integrity and design freedom of the semiconductor device.
Implementation Method 1
the thermosetting resin causes shrinkage as it hardens due to a temperature change of the resin
Data Source
AI summary
A semiconductor device includes a substrate having a first surface, a height adjuster mounted on the first surface of the substrate via a first adhesive layer, a semiconductor chip mounted on the height adjuster via a second adhesive layer, an electronic component mounted on the first surface of the substrate via a third adhesive layer, a bonding wire, and a sealing member. The length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction is larger than the length of the electronic component in the first direction.