Semiconductor Holding Device Oxygen Ingress Prevention
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Solution Overview
Problem
In vehicle-mounted power conversion devices, short circuit failures in semiconductor elements can lead to smoke emission and ignition due to oxygen ingress through cracks in the epoxy resin, which is not effectively addressed by conventional holding structures.
Innovation Solution
A semiconductor element holding device with a package that houses the power semiconductor element, a covering plate larger than the package, and a pressing member that prevents oxygen from entering through cracks, ensuring the plate covers the package and is securely fixed to a cooler to prevent positional displacement and oxygen entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional spring support member is used to fix the semiconductor element, then the element is securely mounted with elastic force, but oxygen can still enter through cracks in the package during short circuit failure
Solution Approach 1:
A plate is introduced as an intermediary component between the semiconductor element package and the external environment. This plate covers the package surface and prevents oxygen from reaching cracks in the epoxy resin, thereby eliminating the harmful effect of oxygen ingress while maintaining the mounting reliability provided by the spring support member
Solution Approach 2:
The plate is positioned and pressed against the package before oxygen can enter through potential cracks. By establishing this protective barrier in advance, the system prevents the harmful action of oxygen diffusion to the semiconductor element during short circuit failure conditions
2Object-affected harmful factors
If the plate is made larger than the package, then oxygen entry is effectively blocked, but the device structure becomes more complex
Solution Approach 1:
The plate serves multiple functions simultaneously: it acts as a protective barrier against oxygen ingress, provides a mounting surface for the pressing member, and seals the package surface. By consolidating these functions into a single component, the design achieves effective oxygen prevention without proportionally increasing structural complexity
3Reliability
If the pressing member applies strong pressure, then the plate is securely fixed and prevents displacement, but the package may be damaged
Solution Approach 1:
The spring support member provides elastic cushioning between the pressing member and the package. This elastic element distributes the pressing force uniformly and prevents excessive localized stress that could damage the package, while still maintaining sufficient pressure to secure the plate against displacement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents smoke emission and ignition by blocking oxygen from entering the package during a short circuit failure, ensuring reliable operation and safety in power conversion devices.
Implementation Method 1
a spring support member including a leaf spring portion and a supporting portion brings the leaf spring portion into abutment against an upper surface of a semiconductor element, thus fixing the semiconductor element to the heat dissipation plate side with a predetermined elastic force
Implementation Method 2
a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package
Data Source
AI summary
A problem to be solved by the present invention is to prevent smoke emission and ignition of a power semiconductor element that is installed inside a power conversion device connected to a battery in the field of power electronics, for example. A semiconductor holding device according to the present invention includes: a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package; a plate covering a second surface opposing the first surface of the package; and a pressing member pressing the plate against the package.