Semiconductor Holding Tabs for Safe Wafer Singulation
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Solution Overview
Problem
The existing methods for holding semiconductor devices in a wafer assembly face challenges such as fragile sharp edges leading to silicon splinters and damage during the singulation process, and the tendency of devices to flip over when separated, which complicates the efficient and safe removal of individual dies from the frames.
Innovation Solution
A system where semiconductor devices are held using a bar connected to the wafer, with sidewalls and tabs of varying thicknesses forming U- or L-shaped holders, allowing for easy breaking and minimizing the risk of damage during separation, as the tabs are designed to break before the thicker structural components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the gaps between devices and frames are kept as small as possible to maximize devices per wafer, then the number of devices per wafer increases, but the devices become more difficult to handle and are more prone to damage during singulation
Solution Approach 1:
The patent introduces holding tabs as intermediary elements that connect devices to frames. These tabs provide a dedicated interface for handling devices during singulation, allowing operators to grip the tabs rather than directly contacting the device edges. This mediator structure enables safe handling even when gaps between devices and frames are minimized, thus resolving the contradiction between maximizing device density and maintaining ease of operation.
2Productivity
If conventional holding methods are used with tweezers to grab devices directly, then the singulation process can be performed, but the sharp edges of devices break easily creating silicon splinters that damage devices
Solution Approach 1:
The holding tabs serve as intermediary structures that replace direct contact with device edges. Instead of using tweezers to grab the sharp edges of devices, operators grip the holding tabs which are designed to be broken. This intermediary approach maintains productivity while eliminating the harmful effect of edge contact, thus preserving device integrity.
Solution Approach 2:
The holding tabs are designed as disposable sacrificial elements that are intended to be broken during singulation. Rather than risking damage to valuable devices, the system uses inexpensive tabs that can be easily broken without consequence. This principle resolves the contradiction by providing a low-cost alternative that protects device integrity while maintaining process efficiency.
3Ease of manufacture
If pressure is applied at one side of the device to separate it from the frame, then the device can be separated, but the device tends to flip over and may be damaged
Solution Approach 1:
The patent extends the holding tab structure beyond the single side where pressure is applied. By creating tabs that wrap around or extend to multiple sides of the device, the system adds dimensional support that prevents flipping. This allows easy separation through tab breaking while maintaining device stability, resolving the contradiction between ease of manufacture and reliability.
Data Source
AI summary
An apparatus and method for holding a semiconductor device in a wafer. A bar is connected to the wafer. A first sidewall comprises a first end and a second, and is connected to the bar at its first end. A first tab comprises a first end and a second end, and is connected to the second end of the first sidewall at its first end and connected to the first side of the semiconductor device at its second end. The thickness of the first tab is less than the thickness of the bar and the thickness of the first sidewall.