Semiconductor Hole Pattern Position Detection

Solution Overview

Problem

Existing pattern matching technologies struggle to accurately detect positional information of hole patterns on semiconductor wafers when the shapes of the patterns in CAD data differ significantly from those in the actual image data due to miniaturization and variations in light-exposure conditions, leading to inaccurate position detection.

Innovation Solution

A pattern matching apparatus and semiconductor inspection system that utilize a pattern extraction unit, central-position data detection units, and collation units to accurately detect positional information by comparing central-position data from CAD data with image data, even when hole shapes are deformed, through edge detection, voting processes, and image data synthesis.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If geometric resemblance between CAD data patterns and photographed image patterns is used for pattern matching, then inspection accuracy is high when pattern shapes are similar, but position detection accuracy deteriorates when hole patterns are miniaturized and shapes are largely different

Engineering Contradiction:

Improvepattern position detection accuracyVSAvoidadaptability to shape variations

Core Design Contradiction:

Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The invention extracts only the essential positional information (center coordinates) from the pattern data, separating it from the shape information. By detecting center position data independently from shape characteristics, the system can accurately match patterns even when their shapes differ significantly due to miniaturization or process variations.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the matching parameter from geometric shape resemblance to center position coordinate comparison. By transforming the pattern matching approach to rely on positional parameters rather than shape parameters, the system becomes adaptable to various pattern shapes while maintaining high detection accuracy.

Inventive Principle:

Principle #35Parameter changes

2Measurement precision

If complete pattern shape matching is performed, then accurate position detection is achieved for regular patterns, but detection accuracy deteriorates for miniaturized hole patterns with deformed shapes

Engineering Contradiction:

Improveposition detection accuracyVSAvoiddetection reliability under miniaturization

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The invention extracts only the essential positional information (center coordinates) from the pattern data, separating it from the shape information. By detecting center position data independently from shape characteristics, the system can accurately match patterns even when their shapes differ significantly due to miniaturization or process variations.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If pattern matching relies on shape resemblance, then inspection is accurate for well-formed patterns, but false detections increase when light-exposure conditions cause shape variations

Engineering Contradiction:

Improveinspection reliabilityVSAvoidfalse detections due to shape deformation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The invention extracts only the essential positional information (center coordinates) from the pattern data, separating it from the shape information. By detecting center position data independently from shape characteristics, the system can accurately match patterns even when their shapes differ significantly due to miniaturization or process variations.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the matching parameter from geometric shape resemblance to center position coordinate comparison. By transforming the pattern matching approach to rely on positional parameters rather than shape parameters, the system becomes adaptable to various pattern shapes while maintaining high detection accuracy.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS7991218B2Pattern matching apparatus and semiconductor inspection system using the same

Publication Date: 2011.08.02 HITACHI HIGH TECH CORP

AI summary

Solving means is configured of a signal input interface, a data calculation unit, and a signal output interface. The signal input interface allows image data which is obtained by photographing hole patterns, and CAD data which corresponds to hole patterns included in the image data, to be inputted. The data calculation unit includes: CAD hole-pattern central-position detection means which detects central positions respectively of hole patterns included in the CAD data from the CAD data, and which generates data which represents, with an image, the central positions of the respective hole patterns; pattern extraction means which extracts pattern data from the image data; image hole-pattern central-position detection means which detects central positions of the respective hole patterns in the image data from the pattern data, and which generates data which represents, with an image, the central positions of these hole patterns detected from the image data; and collation process means which detects positional data in the image data corresponding to that in the CAD data through a process of collating the CAD hole-pattern central-position data with the image hole-pattern central-position data. The signal output interface outputs the positional data outputted from the data calculation unit.