Semiconductor Hollow Structure Encapsulation via Partial Casting
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Solution Overview
Problem
Existing methods for creating hollow structures in semiconductor devices are costly and prone to mechanical stress during the encapsulation process, which can damage the structures and limit their functionality.
Innovation Solution
A method involving structuring a polymer layer on a wafer, dividing it into chips, and encapsulating them in casting compound to form hollow structures without encapsulating the top region, allowing for low-cost production and reduced mechanical stress on the hollow enclosures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hollow structures are created by structuring a layer and closing with a cover, then hollow structures are formed, but mechanical stress during encapsulation can damage the structures
Solution Approach 1:
The patent removes the hollow enclosure from the encapsulation process by leaving it open at the top. The casting compound is applied around the chip but not over the hollow structure, thereby extracting the hollow enclosure from the path of mechanical stress during encapsulation while still providing protection to the chip substrate.
Solution Approach 2:
The patent applies different treatment to different regions of the chip: the substrate and peripheral areas are encapsulated in casting compound for protection, while the hollow enclosure region is left open to avoid mechanical stress. This local differentiation allows simultaneous protection of the chip and preservation of the hollow structure.
2Reliability
If conventional encapsulation methods are used, then chip protection is achieved, but production cost increases and mechanical stress damages hollow structures
Solution Approach 1:
The patent applies partial encapsulation rather than complete encapsulation. The casting compound is applied only to regions where protection is needed (substrate and periphery), while deliberately excluding the hollow enclosure area. This partial action reduces material usage, simplifies the process, and avoids damage to the hollow structure.
3Ease of operation
If the wafer is divided into individual chips before encapsulation, then chip-level packaging is achieved, but handling and alignment complexity increases
Solution Approach 1:
The patent combines wafer-level processing with chip-level packaging benefits. Multiple chips are processed together on the wafer substrate, and the casting compound is applied to multiple chips simultaneously in one operation. This merging approach maintains chip-level packaging flexibility while reducing handling complexity by processing groups of chips together rather than individually.
Data Source
AI summary
A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.