Semiconductor Package Hot Spot Marking for Thermal Alignment

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Solution Overview

Problem

Semiconductor packages face thermal stress and heat dissipation issues during operation, particularly due to the challenge of accurately positioning heat dissipation layers during assembly, which can lead to reduced thermal efficiency and operational faults.

Innovation Solution

Incorporating a mark on the semiconductor package to indicate the position of hot spots, with a heat dissipation layer that covers the mark, ensuring effective heat dissipation even if the heat dissipation layer is moved from its proper position during assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a heat dissipation layer is provided on the semiconductor package without a positioning mark, then the manufacturing process is simpler, but the heat dissipation layer may not be accurately positioned over the hot spot, reducing thermal efficiency

Engineering Contradiction:

Improvepositioning accuracy of heat dissipation layerVSAvoidstructure complexity of semiconductor package

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

A positioning mark is formed on the semiconductor package surface before the heat dissipation layer is attached. This mark serves as a reference for aligning the heat dissipation layer with the hot spot, ensuring accurate positioning without requiring complex alignment mechanisms during assembly.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The positioning mark acts as an intermediary element between the hot spot (which is embedded in the semiconductor chip) and the heat dissipation layer. It provides a visible reference on the package surface that corresponds to the subsurface hot spot location, enabling precise alignment of the heat dissipation layer.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the heat dissipation layer is made large to ensure coverage of the hot spot, then thermal efficiency is improved, but the device size increases

Engineering Contradiction:

Improvethermal management reliabilityVSAvoidsurface area of semiconductor package

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The positioning mark is formed in advance to precisely indicate the hot spot location. This allows the heat dissipation layer to be optimally sized and positioned to cover only the necessary area, avoiding excessive material usage and package size increase while ensuring complete hot spot coverage.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Instead of providing uniform heat dissipation across the entire package surface, the heat dissipation layer is concentrated specifically at the hot spot location as indicated by the positioning mark. This localized approach improves thermal management efficiency while minimizing the overall area occupied by the heat dissipation structure.

Inventive Principle:

Principle #3Local quality

3Productivity

If the heat dissipation layer is attached without a positioning reference, then the assembly process is faster, but the heat dissipation layer may be misplaced, causing operational faults

Engineering Contradiction:

Improveassembly speedVSAvoidoperational reliability of semiconductor device

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The positioning mark is prepared in advance on the semiconductor package surface before assembly. During the attachment process, the heat dissipation layer can be quickly aligned with this pre-existing mark, maintaining fast assembly speed while ensuring correct positioning and operational reliability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The positioning mark provides a self-aligning feature that guides the heat dissipation layer into the correct position during assembly. The operator or automated system can visually or mechanically align with the mark, eliminating the need for complex external alignment tools or procedures, thus maintaining high assembly productivity.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances thermal characteristics of semiconductor devices by ensuring that hot spots are consistently covered by the heat dissipation layer, preventing deterioration of heat-dissipation properties and reducing the risk of operational faults.

Implementation Method 1

a heat dissipation layer provided on the mold layer to cover the mark

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS9870977B2Semiconductor device with heat information mark

Publication Date: 2018.01.16 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor device includes a semiconductor package and a mark. The semiconductor package includes a semiconductor chip including a hot spot from which heat is generated, and a mold layer encapsulating the semiconductor chip. The mark is disposed on the semiconductor package. The mark is formed in a region of the semiconductor package that corresponds to a position of the hot spot.