Semiconductor Package Hot-Melt Link for PCB Overcurrent Protection
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Solution Overview
Problem
Existing semiconductor devices lack effective overcurrent protection mechanisms, leading to potential damage and burning of printed circuit boards when overcurrent occurs, as existing solutions do not adequately prevent overheating and subsequent damage to the circuit board.
Innovation Solution
A semiconductor device design incorporating a conductive hot melt layer, redistribution layer, and insulation layer, where the conductive hot melt layer is electrically connected to conductive pads and melts to create a gap when overheated, disconnecting the electrical connection and preventing further heating, thereby protecting the circuit board from damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a power semiconductor device is welded on a printed circuit board to maintain power supply, then the power supply is maintained, but the printed circuit board cannot be repaired once overcurrent occurs and burns the chip and board
Solution Approach 1:
A conductive hot melt layer is introduced as an intermediary protective element between the power semiconductor device and the printed circuit board. This layer serves as a sacrificial component that melts and breaks under overcurrent conditions, preventing direct damage to the expensive circuit board while maintaining normal power supply function during operation
Solution Approach 2:
The conductive hot melt layer is designed as a disposable protective component with lower cost than the printed circuit board. It intentionally undergoes permanent deformation (melting and breaking) when exposed to overcurrent, serving as a sacrificial element that protects more valuable components from damage
2Reliability
If the conductive hot melt layer is formed on conductive pads and electrically connected to them, then electrical connection is achieved, but the device complexity increases
Solution Approach 1:
The conductive hot melt layer is merged with the existing conductive pad structure during the printing circuit board manufacturing process. By combining the protective function with the existing electrical connection structure, the solution avoids adding separate complex protection mechanisms while still achieving overcurrent protection functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents overheating and subsequent damage to the circuit board by ensuring the semiconductor device enters an open-circuit state when overcurrent occurs, thereby safeguarding the printed circuit board from burning.
Implementation Method 1
the conductive hot melt layer can be melted by heat conducted by the chip in the semiconductor device
Implementation Method 2
the conductive hot melt layer can be melted by heat conducted by the chip in the semiconductor device
Implementation Method 3
Due to a capillary effect of the gap, the conductive hot melt layer in a melt state is broken between the first conductive pad and the second conductive pad, and flows into the gap
Data Source
AI summary
A semiconductor device includes a package body, a chip, a redistribution layer, and a conductive hot melt layer. The chip, the redistribution layer, and the conductive hot melt layer are all packaged in the package body. The redistribution layer includes a first conductive pad and a second conductive pad that are disposed at an interval from each other and insulated from each other, wherein a part of the redistribution layer other than the first conductive pad and the second conductive pad is connected to a pin of the chip; and the conductive hot melt layer is formed on a surface of the first conductive pad and a surface of the second conductive pad, and is in electrical contact with both the first conductive pad and the second conductive pad.