Semiconductor Package Housing with Air Gap for Thermal Stress Reduction
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Solution Overview
Problem
Conventional semiconductor packaging experiences reliability issues due to a mismatch in the coefficient of thermal expansion (CTE) between the liquid encapsulation resin and the substrate, leading to thermal stress and decreased package reliability during temperature cycling tests.
Innovation Solution
The implementation of a semiconductor package design that includes a housing with a bottom and top opening, where the substrate is coupled to the housing at the bottom opening and the glass lid is coupled under the housing at the top opening, eliminating contact between the housing and connectors and avoiding CTE mismatch by creating a gap with air or gas, thus reducing thermal stress and wire fatigue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid encapsulation resin is used to seal the semiconductor package, then the connectors are protected from mechanical damage and the glass lid-die coupling area is protected from moisture, but thermal stress increases and reliability decreases due to CTE mismatch between the resin and substrate
Solution Approach 1:
The patent removes the liquid encapsulation resin from the package structure and replaces it with a housing made of a material having a CTE matched to the substrate. This extraction eliminates the CTE mismatch problem while maintaining the protective function through the housing structure that encloses the package components.
Solution Approach 2:
The patent changes the material parameter (CTE) of the encapsulation material from liquid resin (mismatched CTE) to a housing material with CTE matched to the substrate. This parameter change resolves the thermal expansion mismatch issue, reducing thermal stress during temperature cycling while maintaining structural integrity and protection functions.
2Object-affected harmful factors
If liquid encapsulation resin is used to seal the package, then protection against moisture and mechanical damage is achieved, but wire fatigue increases due to thermal expansion mismatch
Solution Approach 1:
The patent extracts the liquid encapsulation resin that causes thermal stress and replaces it with a rigid housing structure. This housing provides both mechanical protection and eliminates the thermal expansion mismatch that causes wire fatigue, thereby extending the duration of action and reliability of the wire connections.
Solution Approach 2:
The patent employs a composite packaging structure consisting of a housing material with CTE matched to the substrate, combined with a glass lid and adhesive layers. This composite structure provides both mechanical protection and thermal compatibility, preventing wire fatigue while maintaining protection against moisture and mechanical damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the semiconductor package by minimizing thermal stress and preventing damage to connectors during temperature cycling, while maintaining protection against mechanical damage and moisture.
Implementation Method 1
a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the bottom opening and the glass lid may be coupled under the housing at the top opening.
Implementation Method 2
simultaneously coupling a housing to the substrate at a bottom opening of the housing and over a glass lid at a top opening of the housing using an adhesive
Implementation Method 3
A mold compound may encapsulate at least a portion of one of the one or more die or at least one of the one or more connectors
Implementation Method 4
eliminating contact between the housing and connectors and avoiding CTE mismatch by creating a gap with air or gas, thus reducing thermal stress and wire fatigue
Data Source
AI summary
Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the bottom opening and the glass lid may be coupled under the housing at the top opening.