Dual-Layer Semiconductor Module Housing for Corrosive Gas Sealing

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Solution Overview

Problem

Power semiconductor module arrangements are vulnerable to corrosion from gases like sulfur-containing compounds, which can lead to chemical degradation and failure of semiconductor components.

Innovation Solution

A housing for power semiconductor modules is designed with a dual-layer structure, where a first layer with multiple openings is covered by a second layer with protrusions that form membranes, sealing the openings to prevent gas ingress while allowing terminal elements to penetrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the housing is made permeable to gases, then ease of manufacture is improved, but reliability deteriorates due to chemical degradation from corrosive gases

Engineering Contradiction:

Improveease of manufactureVSAvoidreliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The lid is constructed as a composite structure with a first layer (e.g., plastic) and a second layer (e.g., metal foil) bonded together. The first layer provides ease of manufacture and forming, while the second layer provides gas impermeability and corrosion protection, resolving the contradiction between manufacturability and reliability.

Inventive Principle:

Principle #40Composite materials

2Reliability

If the lid is sealed completely, then reliability is improved by preventing gas ingress, but ease of operation deteriorates as terminal elements cannot be inserted

Engineering Contradiction:

ImprovereliabilityVSAvoidease of operation

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The lid is segmented into a first layer and a second layer with different properties. The first layer can be formed with openings, while the second layer provides selective sealing. This segmentation allows the lid to be both sealable for reliability and operable for terminal element insertion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second layer is positioned to selectively cover only those openings that need to be sealed, while leaving other openings accessible for terminal element insertion. This local differentiation of sealing properties resolves the contradiction between complete sealing and operational access.

Inventive Principle:

Principle #3Local quality

3Device complexity

If a single-layer housing is used, then device complexity is reduced, but reliability deteriorates due to insufficient protection against corrosive gases

Engineering Contradiction:

Improvedevice complexityVSAvoidreliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The housing lid uses a composite structure of two layers with complementary properties. The first layer provides structural integrity and ease of forming, while the second layer provides gas barrier properties. This composite approach improves reliability without significantly increasing overall device complexity.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The second layer is nested within or bonded to the first layer, creating a compact multi-layer structure. This nesting approach provides enhanced protection against corrosive gases while maintaining a space-efficient design that does not substantially increase device complexity.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dual-layer housing effectively seals the module against air, moisture, and corrosive gases, thereby protecting the semiconductor components and extending the lifetime of the power semiconductor module arrangement.

Implementation Method 1

the second layer comprises a plurality of protrusions, each protrusion extending into a different one of the plurality of openings of the first layer such that each of the plurality of openings is completely covered by one of the protrusions. Each protrusion of the second layer forms a membrane, each membrane covering one of the openings of the first layer, thereby sealing the openings of the first layer to prevent air, moisture and corrosive gases from entering the inside of the housing

Methodology Applied

Scientific EffectSealing:

Implementation Method 2

Each membrane is configured to allow a terminal element to easily penetrate through the membrane when inserting a terminal element through the opening

Methodology Applied

Scientific EffectMembrane penetration:

Data Source

PatentEP4064328B1Housing, semiconductor module and methods for producing the same

Publication Date: 2025.03.05 INFINEON TECHNOLOGIES AG

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AI summary

A housing (7) for a power semiconductor module arrangement (100) comprises sidewalls and a lid, wherein the lid comprises a first layer (72) of a first material comprising a plurality of openings (722), and second layer (74) of a second material that is different from the first material, wherein the second layer (74) completely covers a bottom surface of the first layer (72), and the second layer (74) comprises a plurality of protrusions, each protrusion extending into a different one of the plurality of openings (722) of the first layer (72) such that each of the plurality of openings (722) is completely covered by one of the protrusions. A first end (41) of a terminal element (4) of a power semiconductor module (100) may be inserted through the opening (722) so as to penetrate the second layer (72) in the opening (722).