Semiconductor Module Housing Groove for Reliable Wire Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor modules face issues with gaps forming between lead terminal pads and the housing due to poor contact, which affects the ultrasonic wire bonding process and requires a separate step to fill these gaps with an adhesive agent, complicating the manufacturing process.
Innovation Solution
A semiconductor module design that includes a frame-shaped housing with a groove extending from the substrate to the lead terminal pad, allowing an adhesive agent to fill gaps between the pad and the housing during the joining process, eliminating the need for a separate step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate step is added to fill the gap between the pad and housing with an adhesive agent, then the contact reliability is improved, but the manufacturing process complexity increases
Solution Approach 1:
The groove is formed on the inner peripheral surface of the housing during the insert molding process, before the substrate joining step. This preliminary preparation allows the adhesive agent to automatically fill gaps between the pad and housing when the substrate is joined, eliminating the need for a separate gap-filling step while ensuring reliable contact.
Solution Approach 2:
The groove acts as an intermediary structure that facilitates the flow and distribution of the adhesive agent from the substrate joining interface to the gap between the pad and housing. This intermediary pathway ensures complete gap filling without requiring additional manufacturing steps.
2Manufacturing precision
If the groove is formed on the inner peripheral surface of the housing, then the adhesive agent can fill gaps effectively, but the housing structure becomes more complex
Solution Approach 1:
The groove formation process is merged with the existing insert molding process by adding a simple mold modification. The groove is formed as an integral part of the housing during the same molding cycle, combining two operations into one and minimizing additional complexity while achieving precise gap filling.
3Productivity
If insert molding is used to join the housing and lead terminal, then the manufacturing efficiency is improved, but gaps may form between the pad and housing
Solution Approach 1:
The groove is created at the specific location where gap filling is needed - on the inner peripheral surface of the housing adjacent to the pad area. This localized feature maintains the overall simplicity of the insert molding process while providing targeted improvement in contact precision where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the easy and reliable manufacturing of semiconductor modules by ensuring excellent contact between the lead terminal pads and the housing, improving the wire bonding process and simplifying the manufacturing process.
Implementation Method 1
The inner peripheral surface of the housing has a groove that extends over the entire range from the first surface to the second surface, the groove extending from the substrate toward the pad
Implementation Method 2
when ultrasonic wire bonding is performed on the pad of the lead terminal, resonance of the pad causes transmission loss of ultrasonic waves
Data Source
AI summary
A semiconductor module includes: a substrate for mounting a semiconductor element; a frame-shaped housing that surrounds the substrate; a lead terminal that passes through the housing from an inside to an outside of the housing; and a bonding wire configured to electrically connect the semiconductor element to the lead terminal within the housing. The lead terminal has a pad disposed in the housing. The housing has a first surface that is joined to the pad, and a second surface that is joined to the substrate with an adhesive agent, the second surface facing in a direction opposite to the first surface. The inner peripheral surface of the housing has a groove that extends over the entire range from the first surface to the second surface, the groove extending from the substrate toward the pad.