Semiconductor Housing Grooves for Positioning Stability
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Solution Overview
Problem
Existing low-profile light emitting devices face challenges in reducing thickness and weight, leading to issues with housing tilting during manufacturing and inaccurate positioning due to the use of hanger leads, which can result in faulty products and displacement during chip mounting.
Innovation Solution
A semiconductor device with a housing featuring grooves on its side surfaces that penetrate from the top to the bottom, allowing for improved positioning accuracy and stability by using guide bars or pins, and enabling secure attachment to a lead frame without the need for thin hanger leads, thus preventing tilting and displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the light emitting device is reduced to meet the demand for thinner backlights, then the device becomes more suitable for mobile applications, but the housing becomes more prone to tilting during manufacturing and positioning becomes inaccurate
Solution Approach 1:
The housing is divided into multiple segments with grooves created at specific locations. These grooves segment the housing structure to provide multiple contact points with the lead frame, distributing the support load and preventing tilting even in thin devices
Solution Approach 2:
The grooves act as intermediary structures between the housing and the lead frame. They provide a mechanical interface that enables precise positioning and stable support without requiring thick housing structures
2Device complexity
If thin hanger leads are used to support the housing during manufacturing, then the device complexity is reduced, but the housing stability decreases leading to tilting
Solution Approach 1:
The traditional hanger lead support structure is extracted and replaced by integrating positioning grooves directly into the housing. This eliminates the need for separate thin support leads while providing more stable positioning through the groove structures
Solution Approach 2:
The positioning and support functions are merged into the housing structure itself through the grooves. The housing simultaneously provides structural enclosure and manufacturing support, eliminating the need for separate hanger leads
Data Source
AI summary
The present invention provides a semiconductor device having a structure which is suitable for reduction in thickness and weight.The semiconductor device 1 comprises a housing 12 which has the recess 24 in the front surface 14, the pair of lead electrodes 20 which have the distal ends 34 exposed in the recess 24, protrude from the external surface of the housing 12 and are bent along the bottom surface 16 of the housing 12, and a semiconductor element 36 which is housed in the recess 24 and is electrically connected to the pair of lead electrodes 20. The housing 12 has the grooves 30 which are formed on the pair of side surfaces 18 which adjoin the front surface 14 and the bottom surface 16 on the right and left sides so as to penetrate the housing 12 from the top surface 28 toward the bottom surface 16 of the housing 12. The grooves 30 preferably have width substantially equal to the thickness of the lead electrode 20. The grooves 30 are more preferably formed to be flush with the distal ends 34 of the lead electrode 20.