Power Semiconductor Housing With Removable Insulating Fill
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Solution Overview
Problem
The recyclability of semiconductor arrangements, particularly power semiconductor arrangements, is hindered by the difficulty in removing soft castings used for protection, which are energy-intensive and challenging to disassemble.
Innovation Solution
Replacing soft castings with a free-flowing material containing electrically insulating particles that are easily removable, such as quartz sand or wax, to facilitate disassembly and recycling, while maintaining insulation and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soft castings (silicone encapsulation) are used to protect semiconductor elements, then protection and insulation are improved, but recyclability and ease of removal deteriorate
Solution Approach 1:
The patent changes the physical state and flow properties of the filling material from viscous (soft casting compound) to free-flowing (granular material). This parameter change enables the material to be easily poured in and removed, transforming it from a permanent protective encapsulation to a removable protective filling, thereby improving recyclability while maintaining protection.
Solution Approach 2:
The patent employs a disposable-like approach where the filling material (granular insulating material) can be easily removed and replaced. This allows the semiconductor device to be disassembled, repaired, or recycled without permanent bonding, treating the filling as a consumable protective element that facilitates ease of repair and recycling.
2Reliability
If soft castings are used for protection, then insulation is improved, but manufacturing complexity and energy consumption increase
Solution Approach 1:
The patent extracts the protective and insulating function from the complex soft casting process and implements it through simple granular material filling. By taking out the encapsulation step and replacing it with pouring granular material into the housing, the manufacturing process becomes simpler while maintaining insulation through the electrically insulating properties of the granular material.
Solution Approach 2:
The patent replaces the mechanical soft casting process (requiring injection equipment, curing, and complex molding) with a simpler gravitational pouring process using granular materials. This substitution eliminates complex manufacturing equipment and processes while achieving the same protective and insulating functions through the physical properties of the granular filling material.
3Strength
If soft castings are used, then structural support is improved, but ease of disassembly deteriorates
Solution Approach 1:
The patent changes the filling material from a bonded viscous compound to free-flowing granular material. This parameter change allows the material to provide structural support through its bulk presence and ability to fill voids, while simultaneously enabling easy disassembly by simply pouring the material out, eliminating the need to break bonded joints or use specialized removal tools.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances recyclability, reduces material and energy consumption, and improves the insulation and thermal management of semiconductor arrangements, making them easier to repair and recycle.
Implementation Method 1
a free-flowing material which contains electrically insulating particles and is in direct contact with the at least one semiconductor element
Implementation Method 2
maintaining insulation and thermal conductivity
Data Source
Figure 1
Figure 2
Figure 3~5
AI summary
The invention relates to a semiconductor arrangement (2), in particular a power semiconductor arrangement for a power converter (50), comprising at least one semiconductor element (4), wherein the at least one semiconductor element (4) is arranged in a housing (6), in particular a closed housing. To improve the recyclability of a semiconductor arrangement (2), it is proposed that the housing (6) be at least partially filled with a free-flowing material (30) containing electrically insulating particles (44) and with which the at least one semiconductor element (4) is in direct contact.