Semiconductor Housing Leads Extend Into Enclosure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor chip housings, especially small or thin types like PSSO housings, face issues with bonding wires being inadequately embedded in molding compounds, leading to delamination and wire cracks under mechanical stress due to close proximity to the molding compound surface.
Innovation Solution
The design involves leads that extend more than half the distance between housing sides, ensuring they are well-anchored within the housing, with a configuration that maximizes the embedding depth of bonding wires to 2.0 mm or more, reducing the risk of damage from mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the housing is made very small or thin to reduce size, then the compactness is improved, but the bonding wire embedding depth becomes insufficient leading to delamination and wire cracks
Solution Approach 1:
The patent extends leads in the longitudinal direction beyond the housing boundaries, projecting them at least 0.5 mm beyond opposite housing sides. This dimensional extension compensates for the reduced embedding depth in thin housings by increasing the lead length within the housing, thereby maintaining adequate bonding wire support while achieving compact housing dimensions.
2Length of stationary object
If the bonding wires are embedded close to the molding compound surface to accommodate thin housings, then the housing thickness is reduced, but mechanical stresses cause delamination and wire cracks
Solution Approach 1:
The patent pre-positions leads extending beyond housing boundaries before final assembly, ensuring that bonding wires have sufficient embedding length (at least 0.5 mm projection beyond housing sides) built into the design. This preliminary structural arrangement prevents mechanical stress failures by ensuring adequate wire support is established before any operational stresses occur.
3Reliability
If leads are extended beyond housing boundaries to improve wire embedding, then the structural integrity is improved, but the device complexity increases
Solution Approach 1:
The extended leads serve multiple functions: they provide structural support for bonding wires, extend electrical connections beyond the housing, and enable adequate wire embedding depth without requiring additional components. This multi-functionality achieves improved reliability while avoiding increased device complexity by using the same lead structure for multiple purposes.
Data Source
AI summary
A device including a housing for a semiconductor chip is disclosed. One embodiment provides a plurality of leads. A first lead forms an external contact element at a first housing side and extends at the first housing side into the housing in the direction of an opposite second housing side. The length of the first lead within the housing is greater than half the distance between the first and the second housing side.