Semiconductor Housing Oblique Mounting for Radiation Control

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Solution Overview

Problem

Existing semiconductor chip housings do not efficiently provide oblique radiation, which is required by various applications, as they typically radiate perpendicular or parallel to the mounting plane, lacking a simple and reliable method to adjust radiation angles.

Innovation Solution

A housing design with a front side for fastening the semiconductor chip and a rear side featuring an oblique mounting area and a parallel resting area, allowing the semiconductor chip to radiate at an angle by adjusting the angle between the mounting and fastening areas during production, without the need for additional optical elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the housing uses a conventional mounting area parallel to the fastening area, then the housing structure is simple and easy to manufacture, but the radiation direction is limited to perpendicular or parallel to the mounting plane and cannot achieve oblique radiation

Engineering Contradiction:

Improveradiation direction adjustmentVSAvoidhousing structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The mounting area is designed to run obliquely to the fastening area, creating an asymmetric geometric relationship between the two areas. This asymmetric configuration enables the semiconductor chip to radiate at oblique angles relative to the mounting plane, expanding the radiation direction options beyond conventional perpendicular or parallel orientations without adding complex optical elements

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent introduces a new geometric dimension by orienting the mounting area at an oblique angle to the fastening area. This angular dimension provides an additional degree of freedom for controlling radiation direction, allowing the main radiation direction to be adjusted to various oblique angles simply by changing the mounting orientation

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If additional optical elements are added to achieve oblique radiation, then the radiation direction can be adjusted, but the production costs and device complexity increase

Engineering Contradiction:

Improveradiation angle adjustmentVSAvoidproduction cost and complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent extracts the radiation direction control function from separate optical elements and integrates it directly into the housing geometry. By incorporating the oblique mounting area directly into the housing structure, the need for additional optical elements such as mirrors or lenses is eliminated, simplifying both the device structure and manufacturing process

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The housing structure is merged with the radiation direction control function by integrating the oblique mounting area into the housing body. This consolidation combines the structural support function with the optical direction control function in a single component, reducing the total number of parts and simplifying assembly

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If additional optical elements are used to achieve oblique radiation, then the radiation direction can be controlled, but the construction space required increases

Engineering Contradiction:

Improvemain radiation direction controlVSAvoidconstruction space

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The oblique angle configuration is copied directly from the housing geometry to the radiation direction, eliminating the need for separate optical elements. The angular relationship between the mounting area and fastening area directly determines the radiation angle, creating a space-efficient solution

Inventive Principle:

Principle #26Copying

Data Source

PatentUS9685593B2Housing for a semiconductor chip, housing composite, semiconductor component and method of producing a semiconductor component

Publication Date: 2017.06.20 OSRAM OLED

AI summary

A housing for a semiconductor chip has a front side and a rear side opposite the front side, wherein the front side has a fastening area for the semiconductor chip; the rear side has a mounting area to mount the housing, wherein the mounting area runs obliquely to the fastening area; and the rear side has a resting area running parallel to the fastening area.