Semiconductor Housing Pin Dimensions for Resonance Avoidance
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Solution Overview
Problem
The characteristic frequencies of standard semiconductor component housings can excite the seismic mass of micromechanical acceleration sensors, leading to corrupted measurements due to fixed dimensions and materials specified by the JEDEC standard.
Innovation Solution
Modifying the pin dimensions such as width, thickness, and length outside the JEDEC standard ranges to alter the housing's characteristic frequencies, allowing for optimized resonance avoidance without requiring additional damping measures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the housing dimensions and pin parameters are changed to shift characteristic frequencies outside the resonance range, then measurement precision is improved, but manufacturing precision deteriorates due to deviation from JEDEC standard
Solution Approach 1:
The patent applies parameter changes by systematically modifying pin dimensions (width, thickness, length) and housing geometry parameters to shift the characteristic frequencies of the housing structure. By changing these physical parameters, the resonant frequencies are moved outside the operating range of the acceleration sensor, thereby improving measurement accuracy without requiring additional damping components.
2Reliability
If pin dimensions are modified outside JEDEC standard ranges, then characteristic frequencies are optimized to avoid resonance, but ease of manufacture deteriorates due to non-standard dimensions
Solution Approach 1:
The patent applies local quality by making targeted modifications to specific regions of the pin structure (such as localized width or thickness changes at specific positions) rather than uniformly changing all dimensions. This allows the housing to achieve the desired frequency characteristics while maintaining compatibility with standard manufacturing processes for the majority of the pin structure.
3Reliability
If multiple pin parameters are changed to maximize frequency shift, then reliability is improved, but device complexity increases due to multiple variable modifications
Solution Approach 1:
The patent applies partial action by selecting and modifying only the most critical pin parameters (such as width and length) that have the greatest influence on the characteristic frequencies, rather than uniformly adjusting all possible dimensions. This approach achieves sufficient frequency shifting to avoid resonance while minimizing the number of parameters that need to be precisely controlled during manufacturing.
Data Source
AI summary
A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.