Power Semiconductor Module Housing with Press-On Elements
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Solution Overview
Problem
Power semiconductor module arrangements face issues with uneven force distribution on the housing and substrate, which can negatively affect heat dissipation.
Innovation Solution
Incorporating a housing design with sidewalls and a cover that includes press-on elements between the sidewalls and the cover, these elements are compressed by the cover's pressure, ensuring even force distribution and pressure transfer to the substrate on the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the cover presses directly on the sidewalls without intermediate elements, then the structure is simpler, but the force distribution becomes uneven and heat dissipation is negatively affected
Solution Approach 1:
Press-on elements are introduced as intermediary components between the cover and the sidewalls. These elements mediate the force transmission, distributing the pressure evenly along the sidewalls and ensuring homogeneous force distribution to the substrate, thereby maintaining reliable heat dissipation while preserving structural simplicity
2Reliability
If press-on elements are added between the cover and sidewalls, then force distribution becomes homogeneous and heat dissipation improves, but device complexity increases
Solution Approach 1:
The press-on elements are designed as flexible or elastically deformable components that can be compressed by the cover. This flexibility allows them to conform to the sidewall geometry and distribute forces uniformly, achieving homogeneous pressure distribution and improved heat dissipation without requiring complex rigid structures
3Ease of manufacture
If the housing structure does not include press-on elements, then manufacturing is simpler, but production tolerances and irregularities cannot be compensated
Solution Approach 1:
The press-on elements are designed with specific material properties (elasticity, compressibility) that allow them to deform under compression. This parameter change enables the elements to compensate for variations in production tolerances and irregularities in the housing and substrate, ensuring uniform force distribution even when manufacturing dimensions vary within acceptable ranges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation by ensuring homogeneous force distribution, improving thermal contact between the substrate and the heat sink, and compensating for production tolerances and irregularities.
Implementation Method 1
each of the at least one press-on element is compressed by the pressure that is exerted on the sidewalls by the cover
Implementation Method 2
at least one substrate arranged inside the housing and including a dielectric insulation layer, and a first metallization layer arranged on a first side of the dielectric insulation layer, and a heat sink or base plate
Data Source
AI summary
A power semiconductor module arrangement includes a housing, at least one substrate arranged inside the housing and including a dielectric insulation layer and a first metallization layer arranged on a first side of the dielectric insulation layer, and a heat sink or base plate. The housing includes sidewalls and a cover and is attached to the heat sink or base plate. The sidewalls exert pressure on the at least one substrate such that the at least one substrate is pressed onto the heat sink or base plate. The cover exerts pressure on the sidewalls such that the sidewalls are pressed onto the at least one substrate. The housing further includes at least one press-on element arranged between and directly adjoining the sidewalls and the cover, wherein each of the at least one press-on element is compressed by the pressure that is exerted on the sidewalls by the cover.