Hermetic Semiconductor Housing Electrode Venting for Pressure Relief

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Solution Overview

Problem

Power semiconductor devices with hermetic cases are vulnerable to unpredictable case ruptures due to excessive internal gas pressure during high energy discharge or short-circuit failure modes, posing safety hazards and requiring costly safety measures.

Innovation Solution

Incorporating a deformable portion in the housing electrode that deforms when internal pressure or temperature exceeds a threshold, creating a controlled fluid communication path to relieve pressure and guide emitted gases safely.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a hermetic package is used to seal the housing, then protection against moisture and foreign particles is improved, but vulnerability to uncontrolled case rupture during failure modes increases

Engineering Contradiction:

Improveprotection against moisture and foreign particlesVSAvoiduncontrolled case rupture

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A deformable portion is pre-formed in the housing electrode during manufacturing, creating a predetermined weak point that will deform under excessive pressure or temperature. This preliminary structural feature ensures that when failure occurs, the housing will deform in a controlled manner at the predetermined location rather than rupturing unpredictably

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The deformable portion acts as an intermediary element between the hermetic housing structure and the external environment. When excessive internal pressure or temperature occurs during failure modes, this intermediary component deforms first, creating a controlled pressure relief path that prevents uncontrolled rupture of the entire housing

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If the housing is made completely rigid and strong, then pressure withstand capability is improved, but ability to safely relieve excessive pressure decreases

Engineering Contradiction:

Improvepressure withstand capabilityVSAvoidpressure relief capability

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The housing structure has non-uniform properties: most of the housing maintains high strength and rigidity for normal operation, while the deformable portion in the electrode has locally reduced strength or increased flexibility. This local quality difference allows the housing to be strong overall while having a specific weak point that can deform to relieve pressure

Inventive Principle:

Principle #3Local quality

3Reliability

If no pressure relief mechanism is provided, then hermetic sealing is maintained, but internal pressure buildup during failure leads to explosive rupture

Engineering Contradiction:

Improvehermetic sealingVSAvoidexplosive rupture

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The potential harm of pressure buildup during failure modes is converted into a beneficial controlled deformation event. The deformable portion is designed to deform at specific thresholds, transforming the harmful uncontrolled pressure increase into a controlled pressure relief mechanism that prevents catastrophic failure

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The deformable portion effectively manages pressure release, reducing the risk of explosive ruptures and minimizing hazards by guiding hot gases to a controlled exit point, enhancing safety and reducing the need for additional protective measures.

Implementation Method 1

when a pressure difference between an interior and an exterior of the housing exceeds a threshold differential pressure

Methodology Applied

Scientific EffectPressure differential: Pressure Gradient

Implementation Method 2

or a temperature at the deformable portion exceeds a threshold temperature, so as to transform the housing from a hermetically sealed housing to an open housing

Methodology Applied

Scientific EffectThermal deformation: Thermal Expansion

Data Source

PatentUS12564093B2Semiconductor device

Publication Date: 2026.02.24 DYNEX SEMICONDUCTOR

AI summary

There is provided a semiconductor device 1, comprising: a housing comprising a housing electrode 4; and at least one semiconductor chip 20 arranged within the housing; wherein the housing electrode 4 comprises a deformable portion 15, and the deformable portion 15 is configured to deform when a pressure difference between an interior and an exterior of the housing exceeds a threshold differential pressure or a temperature at the deformable portion exceeds a threshold temperature, so as to transform the housing from a hermetically sealed housing to an open housing in fluid communication with the exterior.