Semiconductor Housing Molding with Interchangeable Terminal Nests

Solution Overview

Problem

Conventional insert molding for semiconductor device housings has limited flexibility in terminal arrangement, requiring multiple molds for different configurations, which is inefficient for producing various terminal arrangements in small quantities and lacks hygroscopic resistance compared to outsert molding.

Innovation Solution

A manufacturing method involving a lower mold with nests and an upper mold that allows for high flexibility in terminal arrangement through resin molding, where the terminals are inserted into specific holes in the lower mold and the upper mold is used to create a housing with integrated terminals, enabling different terminal configurations using interchangeable nests.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional insert molding is used for semiconductor device housing, then hygroscopic resistance is improved, but terminal arrangement flexibility deteriorates

Engineering Contradiction:

Improvehygroscopic resistanceVSAvoidterminal arrangement flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The mold cavity is divided into multiple holes, each capable of receiving a terminal independently. The nest component is segmented into multiple portions that can cover different combinations of holes, allowing flexible selection of which terminals are formed in the housing without changing the mold structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The nest component is made changeable between molding operations. Different nest configurations can be installed in the mold to accommodate different terminal arrangement requirements, making the system dynamic and adaptable rather than fixed.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If multiple molds are prepared for different terminal arrangements, then terminal arrangement flexibility is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improveterminal arrangement flexibilityVSAvoidnumber of molds

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

A single mold structure with multiple holes and a changeable nest component can produce multiple different terminal arrangements. The mold serves multiple functions by accommodating different nest configurations, eliminating the need for separate dedicated molds for each terminal pattern.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The nest component is made changeable between molding operations. Different nest configurations can be installed in the mold to accommodate different terminal arrangement requirements, making the system dynamic and adaptable rather than fixed.

Inventive Principle:

Principle #15Dynamics

3Adaptability or versatility

If outsert molding is used instead of insert molding, then terminal arrangement flexibility is improved, but hygroscopic resistance deteriorates

Engineering Contradiction:

Improveterminal arrangement flexibilityVSAvoidhygroscopic resistance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The mold cavity is divided into multiple holes, each capable of receiving a terminal independently. The nest component is segmented into multiple portions that can cover different combinations of holes, allowing flexible selection of which terminals are formed in the housing without changing the mold structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The nest component is made changeable between molding operations. Different nest configurations can be installed in the mold to accommodate different terminal arrangement requirements, making the system dynamic and adaptable rather than fixed.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method provides a high degree of freedom in terminal arrangement within the semiconductor device housing, improving hygroscopic resistance and reducing the need for multiple molds, thus enhancing manufacturing efficiency and adaptability for various terminal configurations.

Implementation Method 1

resin molding is performed using the lower mold and the upper mold to obtain the housing

Methodology Applied

Scientific EffectResin molding:

Data Source

PatentUS11806903B2Manufacturing method of housing for semiconductor device

Publication Date: 2023.11.07 MITSUBISHI ELECTRIC CORP

AI summary

Each of a plurality of terminals has a first portion and a second portion being a connection target for a semiconductor element. A manufacturing method of a housing includes a first step arranging, for a lower mold provided with a plurality of holes each of which is a target into which the first portion is inserted, a nest having a third portion covering at least one of the holes, a second step arranging, for the lower mold with the nest being arranged therein, the plurality of terminals by inserting the first portion into the hole not covered by the third portion, a third step arranging an upper mold on the lower mold with the nest and the plurality of terminals being arranged therein, and a fourth step, which is executed after the third step, obtaining the housing by performing resin molding using the lower mold and the upper mold.