Semiconductor Identification Mark on Contact Pad
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor devices face challenges in efficiently incorporating identification marks without consuming active areas and requiring additional manufacturing processes, which affects production quality and cost.
Innovation Solution
The method involves structuring a contact pad with a dielectric layer to create an identification mark, allowing information about the chip's properties to be embedded within the pad's geometry, eliminating the need for additional labeling processes and preserving active area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If an identification mark is added to the semiconductor device, then the device can be identified by its properties, but the manufacturing process becomes more complex and costs increase
Solution Approach 1:
The identification mark is merged with the contact pad structure by using the same dielectric layer and patterning process. The contact pad is structured to include both the electrical contact function and the identification mark function, eliminating the need for separate identification mark fabrication processes.
Solution Approach 2:
The contact pad is designed to serve dual functions: providing electrical contact and containing identification information. By embedding the identification mark within the contact pad's dielectric layer, a single structure performs both electrical and identification purposes, reducing overall device complexity.
2Loss of information
If an identification mark is added to the semiconductor device, then the device can be identified by its properties, but manufacturing costs increase due to additional processes
Solution Approach 1:
The identification mark fabrication is combined with the existing contact pad fabrication process. The same dielectric layer deposition and patterning steps used for contact pads are utilized to create the identification mark, eliminating additional manufacturing steps and associated costs.
Solution Approach 2:
The identification mark is created during the preliminary stages of contact pad fabrication, before final assembly. By forming the identification mark structure early in the manufacturing process using existing process steps, no additional post-fabrication processes are required.
3Loss of information
If additional processes are used to create an identification mark, then the mark can be added, but production efficiency decreases
Solution Approach 1:
The identification mark creation process is merged with the contact pad fabrication sequence. Both structures are formed simultaneously using the same process steps including dielectric layer deposition and patterning, doubling the utility of each manufacturing step and improving production efficiency.
Data Source
AI summary
A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip.