Semiconductor Identification Circuit Removing Fuse Cutting

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Solution Overview

Problem

The use of fuses in semiconductor integrated circuits for device identification-code-information circuits leads to reliability issues due to the absence of protective coatings, increased costs from the need for specialized cutting tools, device size limitations, and reduced yield from cutting errors.

Innovation Solution

A semiconductor integrated circuit with a device identification-code-information circuit comprising an internal logical circuit that processes code matching signals to selectively output identification information, reducing the need for external fuses and improving reliability and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a fuse is used for device identification-code-information circuit, then device identification can be achieved, but reliability deteriorates due to absence of protective coating

Engineering Contradiction:
ImprovereliabilityVSAvoidprotective coating absence
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the device identification function from the fuse and relocates it to the internal logic circuit. The fuse is completely removed from the device identification-code-information circuit, eliminating the reliability issue caused by protective coating absence while maintaining the identification capability through internal circuit resources.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The internal logic circuit is designed to serve multiple functions: it performs both the device identification function and normal circuit operations. By making the logic circuit universal, the patent eliminates the need for separate fuse resources and achieves reliable device identification without compromising protective coating integrity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Area of stationary object

If a fuse is used for device identification-code-information circuit, then device identification can be achieved, but device size increases due to fuse area

Engineering Contradiction:
Improvedevice sizeVSAvoididentification capability
Core Design Contradiction:
Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent merges the device identification function with the internal logic circuit resources. By combining these functions, the fuse area is eliminated and the identification capability is integrated into the existing logic circuit structure, thereby reducing overall device size while maintaining adaptability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The internal logic circuit is designed to serve multiple functions: it performs both the device identification function and normal circuit operations. By making the logic circuit universal, the patent eliminates the need for separate fuse resources and achieves reliable device identification without compromising protective coating integrity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If a fuse is used for device identification-code-information circuit, then device identification can be achieved, but manufacturing cost increases due to specialized cutting tools

Engineering Contradiction:
Improvemanufacturing costVSAvoidcutting tool requirement
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent extracts the device identification function from the fuse and relocates it to the internal logic circuit. The fuse is completely removed from the device identification-code-information circuit, eliminating the reliability issue caused by protective coating absence while maintaining the identification capability through internal circuit resources.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The internal logic circuit is designed to serve multiple functions: it performs both the device identification function and normal circuit operations. By making the logic circuit universal, the patent eliminates the need for separate fuse resources and achieves reliable device identification without compromising protective coating integrity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Loss of time

If a fuse is used for device identification-code-information circuit, then device identification can be achieved, but test time increases due to fuse cutting requirement

Engineering Contradiction:
Improvetest processing timeVSAvoidwafer sorting efficiency
Core Design Contradiction:
Loss of timeVSProductivity

Solution Approach 1:

The patent extracts the device identification function from the fuse and relocates it to the internal logic circuit. The fuse is completely removed from the device identification-code-information circuit, eliminating the reliability issue caused by protective coating absence while maintaining the identification capability through internal circuit resources.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The internal logic circuit is designed to serve multiple functions: it performs both the device identification function and normal circuit operations. By making the logic circuit universal, the patent eliminates the need for separate fuse resources and achieves reliable device identification without compromising protective coating integrity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS7997500B2Device identification-code-information circuit and semiconductor integrated circuit having the device identification-code-information circuit
Publication Date: 2011.08.16 LONGITUDE LICENSING LTD
  • US7997500B2 patent drawing
  • US7997500B2 patent drawing
  • US7997500B2 patent drawing

AI summary

In a semiconductor integrated circuit, a device identification-code-information circuit includes an internal circuit which can set device identification code information and which can selectively read the same. This structure enables reduction in size of an LSI chip and improvement in reliability.