Semiconductor Image Alignment Using Pattern Correlation
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Solution Overview
Problem
The accuracy of alignment between signal images of semiconductor devices, particularly between non-defective and defective devices, is poor, making it difficult to generate comparative images effectively.
Innovation Solution
An image processing method that acquires measured images and reference images from semiconductor devices, extracts pattern information, and determines matching information to accurately align and compare the images, enabling the generation of accurate comparative images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If template-based position detection is used to align measured images, then the processing method is simple, but the alignment accuracy between signal images is poor
Solution Approach 1:
The patent introduces pattern images as an intermediary element to facilitate accurate alignment. Instead of directly aligning measured signal images using simple templates, the system uses pattern images (which contain distinctive geometric patterns) as a mediator to establish precise positional relationships between multiple measured images through correlation analysis
Solution Approach 2:
The system performs preliminary alignment using pattern images before conducting the final comparison of measured images. By first establishing accurate positional relationships through pattern matching and correlation analysis, the system prepares the foundation for high-precision comparative analysis of the actual measured images
2Ease of operation
If template-based alignment is used, then the processing is straightforward, but the accuracy of alignment between measured images and pattern images is poor
Solution Approach 1:
The patent replaces simple template-matching mechanics with a more sophisticated correlation analysis system. Instead of using basic template overlay methods, the system employs correlation coefficients and statistical analysis to determine optimal alignment positions, achieving higher precision through mathematical computation rather than simple mechanical template matching
Data Source
AI summary
An image processing method includes a step of acquiring a measured image G1B measured from a semiconductor device S and a first pattern image G2B showing a pattern of the semiconductor device S, a step of acquiring a reference measured image G3B measured from a reference semiconductor device SR being the semiconductor device S or a semiconductor device different from the semiconductor device S and a second pattern image G4B showing a pattern of the reference semiconductor device SR, a step of acquiring matching information indicating a correlation of the first pattern image G2B and the second pattern image G4B, and a step of determining a difference of the measured image G1B and the reference measured image G3B based on the matching information to acquire a comparative image G5B.


