3D Imaging Semiconductor Devices Using Multi-Frequency Radiation
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Solution Overview
Problem
Existing non-destructive analysis tools lack the resolution to accurately measure physical features of semiconductor devices as device geometries continue to decrease in size, impairing performance and requiring more precise fabrication and failure analysis.
Innovation Solution
A method involving irradiation with multiple frequencies of electromagnetic radiation to generate composite three-dimensional images by combining radiation responses, allowing for more accurate determination of material composition and feature measurements by averaging variations in material boundaries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing non-destructive analysis tools are used to image semiconductor devices, then the analysis can be performed without destroying the device, but the resolution is insufficient to accurately measure physical features as device geometries decrease in size
Solution Approach 1:
The imaging process is segmented into multiple frequency components, with different frequency ranges (e.g., first frequency for one material type, second frequency for another material type) used to image different aspects of the semiconductor device. This segmentation allows each frequency to optimize for specific material characteristics, thereby improving overall measurement precision and accuracy.
Solution Approach 2:
The patent changes the frequency parameter of the electromagnetic radiation used for imaging. By using multiple frequency ranges rather than a single frequency, the system can penetrate and interact with different materials in the semiconductor device differently, enabling accurate differentiation and measurement of various physical features while maintaining non-destructive analysis.
2Measurement precision
If a single frequency of electromagnetic radiation is used for imaging, then the imaging process is simpler, but the accuracy of material composition determination and boundary identification is reduced
Solution Approach 1:
The imaging system is segmented into multiple frequency channels, each targeting specific material compositions. The control module separately processes images from different frequency ranges, determining material composition based on frequency-specific radiation responses. This segmentation improves material boundary accuracy while managing complexity through modular processing.
Solution Approach 2:
The imaging system is designed with multi-functionality to handle multiple frequency ranges using a single integrated system. The same imaging device can operate across different frequency spectra, and the control module universally processes all frequency data through a unified image fusion algorithm, reducing the need for multiple separate devices while maintaining high measurement precision.
3Manufacturing precision
If multiple frequencies of electromagnetic radiation are used to generate composite images, then the accuracy of semiconductor device representation is improved, but the imaging process and data processing become more complex
Solution Approach 1:
The control module performs preliminary processing of images from different frequency ranges before fusion. Material composition is determined in advance based on frequency-specific responses, and preliminary three-dimensional images are generated separately. This preliminary action organizes the complex data early in the process, facilitating more efficient final image fusion and reducing overall processing complexity.
Solution Approach 2:
The control module acts as an intermediary that receives images from multiple frequency sources, processes them through a unified algorithm, and produces a fused composite image. This intermediary processing layer manages the complexity by providing a standardized interface between multiple frequency inputs and the final output, enabling accurate fabrication analysis while containing process complexity within a single processing unit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a more accurate representation of semiconductor devices, enabling precise dimension measurements and improved performance by enhancing the resolution of physical feature analysis.
Implementation Method 1
The radiation source emits source radiation, wherein the first target electrode to generates first radiation having a first frequency in response to the source radiation
Implementation Method 2
the first collimation arrangement directs the first radiation from the first target electrode towards a focal point
Data Source
AI summary
Imaging methods, apparatus and systems are provided for using different irradiation frequencies to generate a composite three-dimensional image. One exemplary method for imaging a semiconductor device involves irradiating the semiconductor device with a first frequency of electromagnetic radiation, obtaining a first radiation response from the semiconductor device in response to the first frequency of electromagnetic radiation, irradiating the semiconductor device with a second frequency of electromagnetic radiation, obtaining a second radiation response from the semiconductor device in response to the second frequency of electromagnetic radiation, and generating a composite image of the semiconductor device based at least in part on the first radiation response and the second radiation response.