Semiconductor Package Immersion Molding Void Reduction

Solution Overview

Problem

In three-dimensional semiconductor package structures, voids often form in the channel during the formation of the molding layer, requiring multiple molding operations which increase costs and reduce circuit density.

Innovation Solution

The method involves an immersion molding operation where the channel with small openings is gradually immersed in a fluidic molding material, allowing the material to flow in and residual air to be removed, thereby alleviating void formation and forming a molding layer through a single immersion process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional molding operations are used to form the molding layer, then the molding layer can be formed, but voids occur in the channel requiring multiple molding operations

Engineering Contradiction:

Improvevoid formation in channelVSAvoidnumber of molding operations

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The channel structure is designed with openings at the top surface before the molding operation, allowing air to escape during material filling. This preliminary structural preparation enables complete channel filling in a single molding operation without void formation, eliminating the need for multiple molding steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Instead of attempting to fill the channel from the bottom or using complex multi-step processes, the invention inverts the approach by providing open pathways at the top surface of the channel. This allows air to escape upward while material fills the channel from below, achieving complete filling in one operation.

Inventive Principle:

Principle #13The other way round (Inversion)

2Manufacturing precision

If multiple molding operations are used to eliminate voids, then void formation is reduced, but manufacturing costs increase

Engineering Contradiction:

Improvevoid formation in channelVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The channel structure is designed with openings at the top surface before the molding operation, allowing air to escape during material filling. This preliminary structural preparation enables complete channel filling in a single molding operation without void formation, eliminating the need for multiple molding steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention discards the conventional approach of using multiple molding operations to eliminate voids. Instead, it recovers manufacturing efficiency by designing the channel with built-in air escape pathways, achieving void-free filling in a single operation and thereby reducing manufacturing costs.

Inventive Principle:

Principle #34Discarding and recovering

3Manufacturing precision

If multiple molding operations are used to ensure complete channel filling, then voids are reduced, but circuit density is reduced

Engineering Contradiction:

Improvevoid formation in channelVSAvoidcircuit density

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The channel structure is designed with openings at the top surface before the molding operation, allowing air to escape during material filling. This preliminary structural preparation enables complete channel filling in a single molding operation without void formation, eliminating the need for multiple molding steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention discards the conventional approach of using multiple molding operations to eliminate voids. Instead, it recovers manufacturing efficiency by designing the channel with built-in air escape pathways, achieving void-free filling in a single operation and thereby reducing manufacturing costs.

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces voids in the channel, enhances adhesion between layers, and decreases manufacturing costs by simplifying the molding process into a single step, thereby improving circuit density.

Implementation Method 1

the stacked structure is immersed into a fluidic molding material to render the fluidic molding material flow into the channel through the openings

Methodology Applied

Scientific EffectFluid flow:

Implementation Method 2

residual air in the channel is carried off through the openings of the channel

Methodology Applied

Scientific EffectAir removal:

Data Source

PatentUS11640954B2Semiconductor package structure

Publication Date: 2023.05.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package structure includes a plurality of first dies spaced from each other, a molding layer between the first dies, a second die over the plurality of first dies and the molding layer, and an adhesive layer between the plurality of first dies and the second die, and between the molding layer and the second die. A first interface between the adhesive layer and the molding layer and a second interface between the adhesive layer and the plurality of first dies are at different levels.