Semiconductor Impedance Sensor Pillar Structure
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Solution Overview
Problem
Indirect moisture sensing methods in semiconductor devices require material exposure and delayed measurement, leading to errors and inefficiencies due to material response variance and absorption times.
Innovation Solution
A capacitive sensor device with conductive pillars and a dielectric medium between electrodes allows for direct moisture measurement through ionization and impedance change detection, eliminating the need for specific moisture-sensitive materials and reducing measurement delays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If indirect moisture sensing using moisture-sensitive materials is used, then the system can measure moisture content through material property changes, but measurement delays occur due to material absorption time and errors arise from material response variance
Solution Approach 1:
The patent extracts the moisture-sensitive material from the sensing system and replaces it with direct impedance measurement of the medium. The sensor device measures impedance changes in the medium directly between conductive pillars, eliminating the intermediate material that caused both delays and measurement errors while maintaining the ability to detect moisture content through dielectric property changes
Solution Approach 2:
The patent introduces an intermediary dielectric medium (such as air or gas) that fills the spaces between conductive pillars. This medium acts as a mediator whose impedance changes directly reflect moisture content, allowing real-time measurement without the absorption delays inherent in traditional moisture-sensitive materials
2Reliability
If indirect moisture sensing is implemented, then the system can derive moisture level from material properties, but variance in material response leads to measurement errors
Solution Approach 1:
The patent removes the moisture-sensitive material entirely from the sensing mechanism. Instead of relying on materials that absorb moisture and change properties (which exhibit response variance), the system directly measures impedance changes in the medium between conductive pillars, eliminating the source of measurement inconsistency
Solution Approach 2:
The patent measures changes in electrical impedance parameters of the medium directly, rather than relying on physical or chemical property changes in a material. By monitoring impedance variations in the dielectric medium between conductive pillars, the system achieves consistent and reliable moisture measurements without material response variance
3Ease of operation
If material exposure and absorption time are required for sensing, then indirect measurement can be performed, but productivity decreases due to waiting time before measurement
Solution Approach 1:
The patent enables continuous real-time measurement of moisture content through direct impedance sensing. The conductive pillars continuously monitor impedance changes in the medium without interruption or waiting periods, eliminating the absorption time required by traditional materials and maintaining constant measurement capability
Solution Approach 2:
The patent skips the entire absorption process required by traditional moisture-sensitive materials. By directly measuring impedance changes in the medium between conductive pillars, the system rushes through what would otherwise be a time-consuming material absorption phase, achieving immediate measurement results
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient direct measurement of moisture content by ionizing the medium between electrodes, reducing errors and improving measurement speed compared to indirect sensing methods.
Implementation Method 1
A voltage difference between a positive side and a negative side ionizes a dielectric medium between the pillars
Data Source
AI summary
Described examples include a sensor device having at least one conductive elongated first pillar positioned on a central pad of a first conductor layer over a semiconductor substrate, the first pillar extending in a first direction normal to a plane of a surface of the first conductor layer. Conductive elongated second pillars are positioned in normal orientation on a second conductor layer over the semiconductor substrate, the conductive elongated second pillars at locations coincident to via openings in the first conductor layer. The second conductor layer is parallel to and spaced from the first conductor layer by at least an insulator layer, the conductive elongated second pillars extending in the first direction through a respective one of the via openings. The at least one conductive elongated first pillar is spaced from surrounding conductive elongated second pillars by gaps.