Semiconductor Device In-Case Wiring Resin Part
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Solution Overview
Problem
Conventional semiconductor devices incur increased costs when applied to various products, including small-lot and large-sized semiconductor devices for electric power, due to the need for customized wiring patterns.
Innovation Solution
A semiconductor device design featuring a case with a resin part that includes a conductive film, allowing for wiring between the case and the resin part, which reduces the size and cost of the device by enabling in-case wiring similar to that on a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wiring patterns are formed in a package body for mass-produced products, then cost is reduced, but adaptability to various products including small-lot and large-sized semiconductor devices deteriorates
Solution Approach 1:
The invention divides the wiring structure into two parts: (1) a standard wiring pattern formed on the semiconductor chip during fabrication, and (2) a flexible resin part with conductive films attached to the package body. This segmentation allows the chip to be manufactured with a universal wiring pattern while the resin part can be customized for different products, thereby reducing manufacturing cost while maintaining adaptability.
Solution Approach 2:
The invention extracts the wiring function from the package body substrate and relocates it to the resin part. The resin part is attached to the package body but is not integrated into the substrate structure itself. This extraction allows the wiring pattern to be independently designed and modified without changing the package body, enabling cost-effective mass production with adaptable wiring configurations for different products.
2Adaptability or versatility
If customized wiring patterns are used for various products, then adaptability is improved, but manufacturing cost increases
Solution Approach 1:
The wiring system is segmented into a standardized chip portion and a customizable resin part. The resin part can be easily modified by attaching or removing conductive films, allowing different wiring patterns for different products without requiring expensive retooling or remanufacturing of the entire device.
Solution Approach 2:
The invention allows easy modification of wiring parameters by changing the conductive film configuration on the resin part. Conductive films can be selectively attached or removed to create different wiring patterns, enabling product customization through simple parameter changes rather than complete redesign and remanufacturing.
3Reliability
If wiring is performed on a substrate, then electrical connection is achieved, but device size increases
Solution Approach 1:
The resin part with conductive films is nested within or attached to the package body structure. The conductive films are positioned in recesses or on the inner surface of the package body, utilizing the existing three-dimensional space efficiently. This nesting approach allows wiring functionality to be integrated without increasing the overall device volume.
Solution Approach 2:
The invention transitions from planar wiring on a flat substrate to three-dimensional wiring using the inner surface and recesses of the package body. Conductive films are arranged in vertical and lateral dimensions within the package body volume, enabling efficient electrical connections without increasing the device's external footprint.
Data Source
AI summary
A semiconductor device includes a case enclosing a region where a semiconductor element as a component of an electric circuit exists. A resin part is fixed to an inside of the case in contact with the region. The resin part is provided with a conductive film, which is a part of the electric circuit. The conductive film is provided in the resin part so that the conductive film comes into contact with the region.