Inclined Connector Surface for Semiconductor Joint Material Control

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Solution Overview

Problem

Existing semiconductor devices encapsulated in resin face issues with joint material protrusion causing short-circuits and insufficient joint material spread leading to conductivity degradation and corrosion, due to misalignment and flat connection surfaces.

Innovation Solution

The semiconductor device incorporates a connector with an inclined first connection portion and a through via hole, allowing the joint material to spread and contact the bed portion effectively, preventing protrusion and enhancing conductivity and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a flat connection surface is used between the connector and semiconductor element, then the manufacturing process is simple, but the joint material cannot spread effectively causing conductivity degradation and corrosion

Engineering Contradiction:

Improvejoint material spreadVSAvoidconnection surface structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The connection surface of the connector is changed from flat to inclined, allowing joint material to spread effectively from the semiconductor element toward the bed portion without protrusion, solving the conductivity degradation issue while maintaining manufacturing simplicity

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Volume of moving object

If the connector is positioned close to the semiconductor element, then the device size is reduced, but joint material protrusion occurs causing short-circuits

Engineering Contradiction:

Improvedevice sizeVSAvoidshort-circuit prevention

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The inclined connection surface creates a gradual slope that guides joint material flow, enabling the connector to be positioned closer to the semiconductor element without causing material protrusion and short-circuits, thus reducing device size while maintaining reliability

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Volume of moving object

If the connector is positioned close to the semiconductor element, then space is saved, but misalignment occurs leading to insufficient joint material contact

Engineering Contradiction:

Improvedevice sizeVSAvoidalignment tolerance

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The inclined surface provides a gradual transition zone that compensates for positioning variations, allowing the connector to be placed closer to the semiconductor element while maintaining adequate joint material contact area and alignment tolerance

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The inclined surface introduces a dimensional gradient that provides tolerance for misalignment in the horizontal plane by compensating through the vertical dimension, enabling closer positioning without sacrificing alignment precision

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20230411337A1Semiconductor device and method for manufacturing semiconductor device

Publication Date: 2023.12.21 KK TOSHIBA

AI summary

According to one embodiment, a semiconductor device includes a bed portion, a semiconductor element, and a connector. The semiconductor element has a first electrode electrically connected to the bed portion and a second electrode facing away from the bed portion. The connector includes a first connection portion with a first surface electrically connected to the second electrode. The first surface is inclined in a direction from an outer edge portion of the first surface toward a center of the first surface. A lead portion of the connector is electrically connected to the first connection portion and spaced away from the bed portion.