Semiconductor Light-Emitting Device With Inclined Side Surface
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Solution Overview
Problem
Current display technologies, such as LCDs and AMOLEDs, face challenges including slow response time, difficulty in implementing flexibility, short lifespan, and low yield, while semiconductor light-emitting devices require complex processes for n-contact and p-contact formation, especially when transferring to a substrate.
Innovation Solution
A semiconductor light-emitting device with a second conductive semiconductor layer having an inclined portion and a second conductive electrode that covers this portion, allowing for simplified electrode wiring and fine pitch arrangement, eliminating the need for additional processes post-transfer to a flexible substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If n-contact and p-contact processes are located on the top and bottom in the manufacturing process, then electrode wiring can be implemented, but additional processes or additional transfer processes are required subsequent to transferring the semiconductor light-emitting device to a substrate
Solution Approach 1:
The patent repositions the n-contact from the top surface to the bottom surface of the semiconductor light-emitting device, changing the spatial dimension of contact formation. This dimensional reconfiguration allows both n-contact and p-contact to be formed on the same side (bottom) of the device, eliminating the need for additional transfer processes after substrate mounting and simplifying the overall manufacturing process
2Device complexity
If one-directional electrode wiring is used, then only mesa and isolation processes are required to make n-contact and p-contact, but the process cannot be further simplified
Solution Approach 1:
The patent merges the n-contact formation process with the bottom surface processing by positioning the n-contact on the bottom surface alongside the p-contact. This consolidation combines what were previously separate top and bottom contact formation processes into a single bottom-side operation, reducing the total number of required process steps and enabling further simplification of the manufacturing sequence
Data Source
AI summary
The present invention relates to a display device and, particularly, to a display device using a semiconductor light-emitting device. The display device according to the present invention comprises a semiconductor light-emitting device, and the semiconductor light-emitting device comprises: a first conductive semiconductor layer; a second conductive semiconductor layer having a lateral surface, and overlapped with the first conductive semiconductor layer; a first conductive electrode electrically connected to the first conductive semiconductor layer; and a second conductive electrode electrically connected to the second conductive semiconductor layer, wherein the second conductive semiconductor layer has an inclined part inclined with respect to the lateral surface, and the second conductive electrode is formed so as to cover the inclined part.