Semiconductor Device Inclined Surface Grease Diversion
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Solution Overview
Problem
The expansion of semiconductor components due to heat generation causes grease to be squeezed out between the sealing body and cooling units, potentially leading to electric insulation deterioration between signal terminals, especially when electrically-conductive foreign substances adhere to the grease that flows to the top surface.
Innovation Solution
The top surface of the semiconductor device is designed with inclined surfaces that divert the flowing grease away from the minimum creepage path between signal terminals, preventing it from reaching the critical insulation area, thereby maintaining electric insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If grease is used to fill gaps between cooling units and sealing body to enhance thermal conductivity, then heat radiation is improved, but electric insulation between signal terminals deteriorates when grease flows to the top surface
Solution Approach 1:
The top surface is divided into multiple inclined surfaces (first inclined surface, second inclined surface, third inclined surface, fourth inclined surface) that guide grease flow in different directions, preventing grease from reaching the minimum creepage path between signal terminals while maintaining thermal contact with cooling units
2Temperature
If semiconductor components expand due to heat generation, then thermal management is challenged, but grease is squeezed out between sealing body and cooling units flowing toward top surface
Solution Approach 1:
The inclined surfaces are pre-configured on the top surface to proactively guide grease flow away from the minimum creepage path before grease can reach and contaminate the insulation area, preventing insulation deterioration in advance
3Ease of manufacture
If a flat top surface is used, then manufacturing is simplified, but grease can reach the minimum creepage path between signal terminals
Solution Approach 1:
The top surface is designed with inclined surfaces instead of a flat surface, creating sloped geometry that naturally directs grease flow away from critical areas. This curved/angled configuration maintains ease of manufacturing while effectively preventing grease from reaching the minimum creepage path
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents the grease from reaching the insulation path between signal terminals, thus maintaining reliable electric insulation and preventing potential insulation deterioration.
Implementation Method 1
If the first direction (i.e., a direction in which the first and the second signal terminals project) is directed to a vertically upward direction, each of the first inclined surface and the second inclined surface is inclined in a vertically downward direction from the boundary line or the boundary range toward a circumferential edge of the top surface
Implementation Method 2
Each of the first heat-radiating members and the second heat-radiating members is configured by a material having a higher thermal conductivity than that of a material configuring the sealing body so as to radiate heat generated in the sealing body to the outside of the sealing body
Implementation Method 3
gaps between the respective cooling units and the sealing body (including the heat-radiating members) are filled with grease so as to eliminate fine voids, thereby enhancing the thermal conductivity
Data Source
AI summary
A semiconductor device includes: a sealing body that seals a first semiconductor element and a second semiconductor element; first heat-radiating members exposed at a front surface of the sealing body; second heat-radiating members exposed at a back surface of the sealing body; first signal terminals electrically connected to the first semiconductor element, and projecting from a top surface of the sealing body in a first direction; and second signal terminals electrically connected to the second semiconductor elements, and projecting from the top surface of the sealing body in the first direction. The top surface of the sealing body includes a first inclined surface, a second inclined surface, and a boundary line or a boundary range located therebetween. The boundary line or the boundary range includes at least part of a minimum creepage path between the first signal terminals and the second signal terminals.