Semiconductor Interconnect Layout Using Inclined Vias to Cut Defects

Solution Overview

Problem

The integration of semiconductor devices often results in defects and increased process costs due to the formation and connection of numerous interconnection lines.

Innovation Solution

A semiconductor device design featuring standard cells with inclined vias and connection structures that electrically connect interconnection lines, reducing the length of signal transmission paths and enhancing structural freedom.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If numerous interconnection lines are formed and connected to facilitate signal transmission, then signal transmission capability is improved, but defects increase and process costs increase

Engineering Contradiction:

Improvesignal transmission capabilityVSAvoiddefect rate

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent merges multiple interconnection lines into a single bundled structure, where multiple lines are collectively connected through shared via holes rather than requiring separate via holes for each line. This reduces the total number of via holes needed while maintaining signal transmission capability across multiple lines, thereby reducing defects and process costs.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bundled interconnection line structure serves multiple functions simultaneously: it provides signal transmission for multiple lines, reduces the number of via holes required, and simplifies the overall interconnection architecture. This multi-functional approach addresses both the need for signal transmission and the reduction of defects.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If numerous interconnection lines are formed and connected to facilitate signal transmission, then signal transmission capability is improved, but process costs increase

Engineering Contradiction:

Improvesignal transmission capabilityVSAvoidprocess cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent merges multiple interconnection lines into a single bundled structure, where multiple lines are collectively connected through shared via holes rather than requiring separate via holes for each line. This reduces the total number of via holes needed while maintaining signal transmission capability across multiple lines, thereby reducing defects and process costs.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bundled interconnection line structure serves multiple functions simultaneously: it provides signal transmission for multiple lines, reduces the number of via holes required, and simplifies the overall interconnection architecture. This multi-functional approach addresses both the need for signal transmission and the reduction of defects.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If traditional vertical vias are used to connect interconnection lines, then electrical connection is achieved, but signal transmission path length is increased

Engineering Contradiction:

Improveelectrical connectionVSAvoidsignal transmission path length

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent transitions from traditional vertical via holes to inclined via holes that extend in both vertical and lateral directions. This dimensional change allows the vias to connect interconnection lines at oblique angles, effectively shortening the signal transmission path length while maintaining reliable electrical connection between lines.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The inclined via holes introduce a curved or oblique connection path between interconnection lines, replacing the strictly vertical linear path. This curved approach allows for shorter overall transmission distance by utilizing three-dimensional space more efficiently, reducing the signal transmission path length while maintaining connection reliability.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Data Source

PatentUS20250210523A1Semiconductor device

Publication Date: 2025.06.26 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor device includes standard cells on a substrate, first interconnection lines extending in a first direction and connected to an active region and a gate structure, second interconnection lines extending in a second direction, the second interconnection lines including a first line and a second line electrically connected to the first interconnection lines, first vias electrically connecting at least one of the first interconnection lines and at least one of the second interconnection lines to each other, and a connection structure disposed on the second interconnection lines and connecting the first line and the second line to each other. The connection structure includes a first inclined via connected to the first line and inclined toward the second line, and a second inclined via connected to the second line and inclined toward the first line. Upper ends of the first and second inclined vias are connected to each other.